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New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Mar 30, 2012

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications. This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. This material has excellent chemical resistance to inks.

The 357-348 adhesive/encapsulant has very high fracture toughness and high adhesion to flexible circuits, FR4 and metal substrates. 357-348 meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.

357-348 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 357-348 Wire Bond Encapsulant and Flexible Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

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New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications news release has been viewed 830 times

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  • New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications
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