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BTU'S Fred Dimock to Participate in Reflow Optimization Discussion during NEPCON Shanghai

Mar 30, 2012

Fred Dimock

Fred Dimock

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that Fred Dimock will present at the upcoming Optimizing Reflow of Lead-Free Boards and BGAs round table discussion hosted by EMSNow on Thursday, April 26 at 3:30 p.m. The discussion will take place during the NEPCON Shanghai exhibition at the Shanghai World Expo Exhibition & Convention Center.

The round table discussion will address best practices in lead-free solder electronics assembly. Methods of optimizing reflow oven profiling for consumer, commercial, and high-reliability aerospace and defense applications will be discussed. Additionally, critical issues concerning lead-free electronics such as tin whiskers and solder joint reliability will be considered.

Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, General Electric, and Sylvania. Additionally, he has authored numerous articles on lead-free processing and process control.

For more information about how to optimizing reflow oven profiling, meet company representatives at NEPCON China 2012 or visit www.btu.com.


BTU International is a market-leading, global supplier of advanced thermal processing equipment and processes to the alternative energy and electronics assembly markets. BTU’s equipment and expertise are used in the manufacturing of solar cells and nuclear fuel as well as the production of printed circuit board assemblies and semiconductor packaging. BTU has design and manufacturing operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service worldwide. Information about BTU International is available at www.btu.com.

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