SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Mar 26, 2012

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas. Sponsored by Lockheed Martin, the conference will feature the industry’s leading experts who will explore the full range of whisker theory and practice for the military/aerospace, automotive, medical and consumer sectors.

Tin whiskers have grown into a topic that never fails to arouse lively discussions amongst product designers and manufacturing personnel,” says David Hillman, principal materials & process engineer, Rockwell Collins and conference speaker. “While the impact of tin whiskers is a very real phenomenon, predicting how and when they will occur still needs to be explored. The real questions: Are we being overly conservative about the impact of tin whiskers on products and are we understating the use of tin whisker risk mitigation methodologies?”

The one and a half-day technical conference will kick off on Wednesday, April 18, with a “State of Lead-Free” address by Linda Woody, engineering manager, Lockheed Martin Missile & Fire Control. Other presentations will explore: mitigation measurements and whisker survey of commercial components; effectiveness of photosintering in mitigating tin whisker formation; effects of magnetism on the morphology of lead-free solder and plating; tin-lead conversion process; mechanical and electrical properties of tin, zinc and cadmium whiskers; and whisker growth evidence, root cause, and countermeasures.

Thursday’s conference presentations will begin with the keynote, “Design Simplicity and Collaboration — Advanced Practices for Reducing Lead-Free Risk,” by Steven Betza, corporate director of electronics engineering & packaging, Lockheed Martin Systems Integration. Also on the agenda, presentations from representatives of the UK National Physical Laboratory (NPL), Bosch Automotive-Germany, Philips Healthcare, CALCE-University of Maryland, University of North Texas, Y-12 National Security Complex, AEM Inc., Celestica and Raytheon.

Prior to the technical conference, two half-day workshops will take place on April 17. In the morning session, Senior Research Scientist Michael Osterman, Ph.D., CALCE-University of Maryland, will educate attendees on tin whisker failure risk and mitigation strategies. In the afternoon, Lyudmyla Panashchenko, aerospace engineer, NASA Goddard Space Center, will present “The Art of Appreciating Metal Whiskers,” providing an advanced level of practical guidance.

For more information on the IPC Tin Whiskers Conference or to register, visit

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Oct 20, 2016 -

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings

Oct 20, 2016 -

World PCB Production in 2015 Estimated at $58.6 Billion IPC World PCB Production Report Released

Oct 20, 2016 -

Mayim Bialik Chosen as Opening Keynote at IPC APEX EXPO 2017 Industry votes to hear from actress and neuroscientist

Oct 16, 2016 -

IPC Announces New ESD Control Certification Courses on IPC EDGE

Oct 13, 2016 -

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference’s Session 4 to Focus on Customer Cleaning Challenges/Needs

Oct 09, 2016 -

IPC Celebrates 5th Annual Manufacturing Day

Oct 06, 2016 -

Day 3 Keynote to Address Paths to Medical Device Cleanliness

Sep 29, 2016 -

Volunteers Honored for Contributions to IPC and the Electronics Industry Seventy-Five Awards Presented at Fall Standards Development Committee Meetings

Sep 29, 2016 -

IPC and SMTA to Present High-Reliability Cleaning and Conformal Coating Conference

Sep 29, 2016 -

Third Session of the High-Rel Cleaning & Conformal Coating Conference to Focus on Conformal Coating for Class 2 and 3 Electronic Assemblies

(782) more news from Association Connecting Electronics Industries (IPC)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies? news release has been viewed 682 times

Non-heated dispensing system

Fluid Dispense Pump Integration