SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Mar 26, 2012

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas. Sponsored by Lockheed Martin, the conference will feature the industry’s leading experts who will explore the full range of whisker theory and practice for the military/aerospace, automotive, medical and consumer sectors.


Tin whiskers have grown into a topic that never fails to arouse lively discussions amongst product designers and manufacturing personnel,” says David Hillman, principal materials & process engineer, Rockwell Collins and conference speaker. “While the impact of tin whiskers is a very real phenomenon, predicting how and when they will occur still needs to be explored. The real questions: Are we being overly conservative about the impact of tin whiskers on products and are we understating the use of tin whisker risk mitigation methodologies?”


The one and a half-day technical conference will kick off on Wednesday, April 18, with a “State of Lead-Free” address by Linda Woody, engineering manager, Lockheed Martin Missile & Fire Control. Other presentations will explore: mitigation measurements and whisker survey of commercial components; effectiveness of photosintering in mitigating tin whisker formation; effects of magnetism on the morphology of lead-free solder and plating; tin-lead conversion process; mechanical and electrical properties of tin, zinc and cadmium whiskers; and whisker growth evidence, root cause, and countermeasures.


Thursday’s conference presentations will begin with the keynote, “Design Simplicity and Collaboration — Advanced Practices for Reducing Lead-Free Risk,” by Steven Betza, corporate director of electronics engineering & packaging, Lockheed Martin Systems Integration. Also on the agenda, presentations from representatives of the UK National Physical Laboratory (NPL), Bosch Automotive-Germany, Philips Healthcare, CALCE-University of Maryland, University of North Texas, Y-12 National Security Complex, AEM Inc., Celestica and Raytheon.


Prior to the technical conference, two half-day workshops will take place on April 17. In the morning session, Senior Research Scientist Michael Osterman, Ph.D., CALCE-University of Maryland, will educate attendees on tin whisker failure risk and mitigation strategies. In the afternoon, Lyudmyla Panashchenko, aerospace engineer, NASA Goddard Space Center, will present “The Art of Appreciating Metal Whiskers,” providing an advanced level of practical guidance.



For more information on the IPC Tin Whiskers Conference or to register, visit www.ipc.org/tin-whiskers.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Apr 22, 2017 -

Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

Apr 13, 2017 -

Congressman Discusses U.S. Policy Priorities with Staff at IPC Member-company, VirTex

Apr 11, 2017 -

SEC Suspends Enforcement of Conflict Minerals Rule, Cites IPC Comments Statement from John Mitchell, IPC President and CEO

Apr 11, 2017 -

IPC Membership in Europe Grows to More than 600 Company Sites Brussels office provides full suite of IPC products and services

Apr 04, 2017 -

IPC Supports EU Council Formal Approval of Voluntary Conflict Minerals Requirements for Manufacturers

Mar 31, 2017 -

IPC Announces Growing Industry Support for the Connected Factory Exchange (CFX) Initiative

Mar 31, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

Mar 27, 2017 -

IPC Membership Reaches Significant Milestone IPC membership is now more than 4,000 member-sites strong

Mar 23, 2017 -

IPC Announces Honorees of Government IMPACT Award

Mar 14, 2017 -

IPC Global Marketplace Delivers Intelligent Search Technology

(821) more news from Association Connecting Electronics Industries (IPC)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies? news release has been viewed 793 times

StikNPeel™ Rework Stencils

Metcal soldering rework