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News from BTU International

BTU International Appoints James Yu Director of Operations, China

Mar 21, 2012

James Yu

James Yu

BTU International, Inc., a leading supplier of advanced thermal processing equipment and processes to the alternative energy and electronics manufacturing markets, announces the appointment of James Yu as director of operations, China.

He comes to BTU with an impressive background in operations, including more than 10 years in developing LEAN/Six Sigma cultural-based organizations. These organizations have yielded improvements in quality and inventory reduction. Prior to joining BTU, Yu was the director of Asia operations and general manager, Shanghai for a major international manufacturer of electronics products. He holds a bachelor’s degree in automation control engineering from Shanghai University and a master’s degree in business administration from Webster University and Shanghai University of Finance and Economy.

We are excited to have James heading up our Shanghai operations,” said Jack Antounian, vice president of manufacturing for BTU International. “We have some exciting and challenging plans for achieving operational excellence this year and will be leveraging James’ abilities to help reduce cycle-time and cost all while maintaining focus on product quality.”

“I am honored to be part of BTU China, and very pleased to work with our Global and China team to address the challenges in terms of quality and operation excellences with the development and implementation of a LEAN/6-Sigma based operating system,” said Yu. “We will be building our China operation to be a demand-driven, real-time manufacturing model for growth to satisfy our customers, shareholders and employees,” said Yu.

BTU International is a market-leading, global supplier of advanced thermal processing equipment to the alternative energy and electronics assembly markets. BTU’s equipment and expertise are used in the manufacturing of solar cells and nuclear fuel as well as the production of printed circuit board assemblies and semiconductor packaging.

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