SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • AIM's Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012

AIM's Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012

Mar 19, 2012

Karl Seelig

Karl Seelig

 AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that Karl Seelig, Vice President of Technology, will present at the upcoming International Conference on Soldering & Reliability (ICSR), scheduled to take place May 16-18, 2012 at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada. The presentation titled “Lead-Free Alloy Development” will take place Friday, May 18, 2012 at 8:45 a.m.

The purpose of this paper is to investigate several factors relating to the families of alloys - both low silver and non-silver. These factors include the use of these alloys as possible replacement alloys in solder paste for component attachment, and the comparison of the paste medium chemistries of these alloys and the effects they have as it relates to assembly performance. This paper places alloys in classes of risk for drop shock and thermal shock. Other important characteristics that will be addressed include wetting, voiding and HiP mitigation.

In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.

Jan 29, 2014 -

AIM Solder Expands Technical Support in Mexico

Jan 10, 2014 -

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Nov 08, 2013 -

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Jul 10, 2013 -

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

May 13, 2013 -

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 07, 2013 -

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Apr 30, 2013 -

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 25, 2013 -

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 19, 2013 -

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 08, 2013 -

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

36 more news from AIM Solder »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

AIM's Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012 news release has been viewed 829 times

  • SMTnet
  • »
  • Industry News
  • »
  • AIM's Karl Seelig to Discuss Lead-Free Alloy Development at ICSR 2012
PCB Soldering Tools

PCB 3D AOI