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  • The IPC APEX 2012 trade show in San Diego was an outstanding success for Assembléon.

The IPC APEX 2012 trade show in San Diego was an outstanding success for Assembléon.

Mar 15, 2012

iFlex SMT Pick & Place Platform

iFlex SMT Pick & Place Platform

The IPC APEX 2012 trade show in San Diego was an outstanding success for Assembléon. Assembléon’s latest innovation in pick & place equipment, iFlex, had it's official North America introduction and was well received.  iFlex is unique in combining quality, flexibility, efficiency and cost control in one single machine, thus fulfilling the wishes and needs of today’s industry. The reaction from those attending the show was very enthusiastic, confirming Assembleon’s vision regarding the latest advancements in its intelligent and flexible pick & place machine.

Confirmation also came from Circuits Assembly, recognizing the iFlex with a New Product Innovation (NPI) award in the Component Placement – Multifunction category. The NPI Award recognizes leading new products during the past twelve months.

Assembléon was also rewarded for its customer service, receiving Circuits Assembly’s Service Excellence Award. This award recognizes companies with the highest customer service ratings, as judged by their own customers.

Last but not least, Assembléon’s senior product marketing manager Mark Maas received the Distinguished Committee Service Award  “in appreciation and recognition of his outstanding contributions to the development of IPC-9850A, Surface Mount Placement - Equipment Characterization”.

Assembléon’s next focus is on Nepcon Shanghai (April 25 – 27, booth 1D20), where iFlex will complete its worldwide introduction.

Aug 13, 2012 -

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Jan 22, 2012 -

Assembléon introducing new iFlex pick&place platform at APEX

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ICCO EMT Reports Good First Experience With iFlex

Nov 27, 2011 -

Assembléon Launched New Services For Its A-Series at Productronica

Nov 27, 2011 -

Assembléon Introduced New iFlex Pick & Place Platform, Increasing PCBA Productivity by 30%

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ASSEMBLÉON TO ENTER SEMICON INDUSTRY, INTRODUCING DEDICATED SOLUTION FOR SiP, MCM AND DIE BONDING

Mar 10, 2011 -

Assembléon aims to cut pick pick & place operating costs by 30%

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