SMTA Announces Upcoming Webtorials

Mar 14, 2012

The SMTA is pleased to announce several new online presentations coming up this Spring.  Webtorials are two-part (90 minutes each part) online presentations that provide more depth on a subject and are comparable to half-day tutorials. 

Spring Offerings include:

  • Advanced Component Packages and Processes - Tuesday, March 20 and 27, 2012, Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology
  • Solar Manufacturing and Reliability Web-Conference - March 22 and 23, 2012, Various sessions over 2 days
  • Solder Pad Cratering - Thursday, April 12 and 19, 2012, Presented by: Cheryl Tulkoff, DfR Solutions
  • Cleaning Agent and Equipment Innovations Needed to Clean Highly Dense Assemblies - Tuesday, May 22 and 29, 2012, Presented by: Mike Bixenman, Kyzen Corporation
  • PWB Reliability Failure Modes - Tuesday, June 19 and 26, 2012, Presented by: Paul Reid, PWB Interconnect Solutions Inc.

For more information contact Patti Hvidhyld at 952-920-7682 or or visit the online presentations page at

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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