The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.
The technical conference features 30 presentations on topics ranging from BGA Voids to Conformal Coating to Design for Manufacturability and Package on Package assembly issues. Speakers will represent Celestica, Cookson Electronics, Creation Technologies, IBM, Indium Corporation, Intel Corporation, Nihon Superior Co., Rockwell Collins, Sandia National Laboratories, and many other companies and schools.
On Thursday, May 17, Paul Vianco, Ph.D. from Sandia National Laboratories will deliver the Keynote Presentation on "Computational Modeling: On the Critical Path for Predicting Solder Joint Reliability."
The SMTA Lead-Free Academy, Tuesday, May 15, will feature the following tutorials:
- Troubleshooting the SMT and Through Hole Assembly Process using an Analytical Approach (Full-Day)
- Weeding out PCB Fabrication Defects Before Assembly (Half-Day)
- Tin Whiskers - a 2012 State of the Industry Assessment (Half-Day)
The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on Wednesday, May 16th. Conference participants may attend the expo for no charge. Complimentary technical presentations will be offered throughout the day in the exhibit hall. Contact Seana Wall at 952-920-7682 or Seana@smta.org for more information or if your company is interested in exhibiting.
For more information or to register visit: http://www.smta.org/icsr
Contact Patti Hvidhyld at 952-920-7682 or email@example.com with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.