130 Awards Presented at IPC APEX EXPO
IPC - Association Connecting Electronics Industries® presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
This year, two Presidents Awards were presented. William Coleman, Ph.D., Photo Stencil Inc. received a Presidents Award for his dedicated service and technical contributions over the past 15 years in the area of solder stencils as an author and IPC task group chair and as a speaker at numerous IPC conferences. Mike Bixenman, DBA, Kyzen Corporation, also received a Presidents Award for his dedicated service as the 5-31g Cleaning and Coating Task Group chair and for his contributions as chair of past cleaning and coating conferences and as a speaker in numerous other IPC conferences.
Awards were also presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through active IPC committee service.
For leadership and valuable service as chair of the IPC PCB Suppliers Management Steering Committee, Don Walsh, Uyemura International Corporation, earned a Special Recognition Award.
For leadership of the 5-41 SMT Component Placement Equipment Subcommittee that developed IPC-9850A, Surface Mount Placement Characterization, Michael Cieslinski, Panasonic Factory Solutions Company of America, and Peter Borg, Research in Motion Limited, were honored with Committee Leadership Awards. For their contributions to IPC-9850A, Nils Jacobsson, MYDATA automation AB, and Mark Maas, Assembleon Netherlands B.V., earned Distinguished Committee Service Awards.
For leadership of the 5-32b SIR and Electrochemical Migration Task Group that developed IPC-9202, Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance, Graham Naisbitt, Gen3 Systems Limited; Douglas Pauls, Rockwell Collins; and Russell Shepherd, Microtek Laboraories, received Committee Leadership Awards. For their contributions to IPC-9202, Brian Madsen, Ph.D., Continental Automotive Systems; Chris Mahanna, Robisan Laboratory Inc.; Joseph Russeau, Precision Analytical Laboratory, Inc.; and Kirk Van Dreel, Plexus Manufacturing Solutions, earned Distinguished Committee Service Awards.
For their leadership of the D-23 High Speed/High Frequency Base Materials Subcommittee that developed IPC-4103A, Specification for Base Materials for High Speed/High Frequency Applications, Edward Sandor, Taconic Advanced Dielectric Division, and Roy Keen, Rockwell Collins, were bestowed with Committee Leadership Awards. Distinguished Committee Service Awards went to Silvio Bertling, Neltec, Inc.; Michael Brandon, Isola Group SARL; Joseph Davis, Rogers Corporation; Patricia Dupuis, Raytheon Company; Matthew Walsh, NSWC Crane; Dan Welch, Arlon Materials for Electronics; and Lowell Sherman, Defense Supply Center Columbus, for their contributions to IPC-4103A.
For co-chairmanship of the 5-21e Solder Stencil Task Group that developed IPC-7525B, Stencil Design Guidelines, William Coleman, Ph.D., Photo Stencil Inc., and George Oxx Jr., Jabil Circuit, Inc., were honored with Committee Leadership Awards. William Kunkle, MET Associates Inc., and Russell Nowland, Alcatel-Lucent, earned Distinguished Committee Service Awards for their contributions to IPC-7525B.
For leadership of the 5-22f J-STD-001 Handbook Task Group that developed IPC-HDBK-001E, Handbook and Guide to Supplement J-STD-001, Daniel Foster, U.S. Army Aviation & Missile Command, and Kathy Johnston, Raytheon Missile Systems, received Committee Leadership Awards. Distinguished Committee Service Awards for contributions to IPC-HDBK-001E went to: David Adams, David Hillman and Douglas Pauls, Rockwell Collins; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Casimir Budzinski, Safari Circuits Inc.; David Carlton, Calette Chamness, Jennifer Day and Sharon Ventress, U.S. Army Aviation & Missile Command; Bettye Causion and Teresa Rowe, AAI Corporation; Matt Garrett, Phonon Corporation; Greg Hurst, BAE Systems; Paula Jackson, Raytheon Systems Ltd.; Joseph Kane, BAE Systems Platform Solutions; Patrick Kane, Raytheon System Technology; Sean Keating, Amphenol Limited (UK); Leo Lambert and Helena Pasquito, EPTAC Corporation; John Mastorides, Honeywell International; Norman Mier Jr., BEST Inc.; Mary Muller, Crane Aerospace & Electronics; David Nelson, Raytheon Company; Gregg Owens, Space Exploration Technologies; Richard Rumas, Honeywell Canada; Patricia Scott, STI Electronics, Inc.; and Zenaida Valianu, Celestica.
For her chairmanship of the 7-31ft task group that developed hands-on training for the IPC/WHMA-A-620 Technical Training program and the IPC/WHMA-A-620AS Space Addendum Training and Certification course, Debbie Wade, Advanced Rework Technology–A.R.T., was recognized with a Committee Leadership Award. For contributions to the optional hands-on training for the IPC/WHMA-A-620 Training and Certification course, Leo Lambert, EPTAC Corporation; Richard Rumas, Honeywell Canada; Blen Talbot, L-3 Communications; Terry Clitheroe, Solder Technologies; and Stephen Fribbins, Fribbins Training Services, received Distinguished Committee Service Awards. Distinguished Committee Service Awards also went to Robert Cooke, NASA Johnson Space Center; Robert Humphrey, NASA Goddard Space Flight Center; Garry McGuire, NASA Marshall Space Flight Center; and Mel Parrish and Brandy McGinniss, STI Electronics, Inc., for their contributions to the development of the IPC/WHMA-A-620AS Space Addendum Training and Certification course. For contributions to the development of both the optional hands-on training for the IPC/WHMA-A-620 Technical Training program and the IPC/WHMA-A-620AS Space Addendum Training and Certification course, Patricia Scott, STI Electronics, Inc., and Daniel Foster, U.S. Army Aviation & Missile Command, earned Distinguished Committee Service Awards.
For leadership of the D-11 Flexible Circuits Design Subcommittee that developed IPC-2223C, Sectional Design Standard for Flexible Printed Boards, William Ortloff Sr., Raytheon Company, and Mark Finstad, Flexible Circuit Technologies, Inc., earned Committee Leadership Awards. For their contributions to IPC-2223C, Lance Auer and Steve Musante, Raytheon Missile Systems; John Bauer, Rockwell Collins; Thomas Gardeski, Gemini Sciences LLC; Nick Koop, Minco Products Inc.; Robert Sheldon, Pioneer Circuits Inc.; and Clark Webster, ALL Flex LLC, were honored with Distinguished Committee Service Awards.
For their leadership of the 7-35 Assembly and Joining Handbook Subcommittee that developed IPC-AJ-820A, Assembly and Joining Handbook, Mary Muller, Crane Aerospace & Electronics, and Joseph Kane, BAE Systems Platform Solutions, were bestowed with Committee Leadership Awards. For their contributions to IPC-AJ-820A, David Adams, Rockwell Collins; Peggi Blakley, NSWC Crane; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Nancy Chism, Flextronics; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Hue Green, Lockheed Martin Space Systems Company; Leo Lambert, EPTAC Corporation; Randy McNutt, Northrop Grumman Corp.; Teresa Rowe, AAI Corporation; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned Distinguished Committee Service Awards.
For co-chairmanship of the 4-14 Plating Processes Subcommittee that developed Amendment 1 to IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, George Milad, Uyemura International Corp. and Gerard O’Brien, Solderability Testing & Solutions, Inc., were honored with Committee Leadership Awards. For their contributions to IPC-4554, Amendment 1, Distinguished Committee Service Awards went to Martin Bayes, Ph.D., Dow Electronic Materials; Trevor Bowers, Adtran Inc.; Ellen Finch and Thomas Gahagan, Anaren Microwave Inc.; Albin Gruenwald and Donald Gudeczauskas, Uyemura International Corp.; David Hillman, Rockwell Collins; Henry Lajoie and James Trainor, OMG Electronic Chemicals Inc.; Brian Madsen, Ph.D., Continental Automotive Systems; Mustafa Oezkoek and Gustavo Ramos, Atotech Deutschland GmbH.
For their leadership of the 5-24a Flux Specifications Task Group that developed Amendment 1 to J-STD-004B, Requirements for Soldering Fluxes, Renee Michalkiewicz,Trace Laboratories – Baltimore, andJohn Rohlfing, Delphi Electronics and Safety, earned Committee Leadership Awards. For their contributions to J-STD-004B, Amendment 1, Tim Jensen, Indium Corporation of America; David Scheiner, Kester; Karen Tellefsen, Ph.D., Cookson Electronics; and Brian Toleno, Ph.D., Henkel Corporation, received Distinguished Committee Service Awards.
For co-chairmanship of the 2-18f Declaration of Shipping, Pack and Packing Materials Task Group that developed IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials, John Ciba Jr., Brady Corporation, and Lee Wilmot, TTM Technologies, Inc., were recognized with Committee Leadership Awards. Honored with Distinguished Committee Service Awards for their contributions to IPC-1758 were: Christine Blair, STMicroelectronics Inc.; Matt Carey, TTM Technologies; Krista Crotty, Alberi EcoTech; Amanda Davidson, Freescale Semiconductor, Inc.; Randall Flinders, RTF Compliance LLC; Robert Green, RDG Company LLC; William Haas, Seagate Technology; Michael Hutchings, Oracle America, Inc.; Kurk Kan, Murata Power Solutions, Inc.; Marcus Khoo, Altera Corporation; Richard Kubin, ProCM; John Messina, NIST; Jack Olson, Caterpillar Inc.; Daphane Robinson, Brady Corporation; John Sharp, TriQuint Semiconductor Inc.; Aimee Siegler, Benchmark Electronics Inc.; and Kelly St. Andre and Jorgen Vos, PTC.
For more information on these awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va..; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.