SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nihon Superior Co., Ltd.


Nihon Superior to Introduce New Soldering Developments at the 2012 IPC APEX Expo

Feb 22, 2012

X-Ray images of voiding after N2 Reflows comparing with Vacuum and no-Vacuum

X-Ray images of voiding after N2 Reflows comparing with Vacuum and no-Vacuum

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.

Substantial cost savings can be achieved with the aluminum soldering process due to the significantly lower cost of aluminum compared to copper. One such application is in the tabbing of solar cells in solar modules and panels. SN100C solder coated aluminum ribbon provides the ease of attachment with traditional soldering processes while providing the cost savings of aluminum.  The aluminum soldering process also offers savings in applications such as wire harnesses, the attachment of enameled aluminum wire motor leads, and soldering of aluminum heat sinks.
 
SN100C P810 D4 is especially designed for use in vacuum reflow with nitrogen. The high-reliability no-clean lead-free solder paste is optimized to deliver excellent reflow characteristics while reducing voiding. The vacuum reflow process reduces voiding compared to the traditional reflow process; however, SN100C P810 further reduces voiding to less than one percent in measured void area. Additional benefits to users include excellent wetting behavior, and SN100C P810 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with 240°C peak. The paste is a compliant alloy that provides high impact strength and substantial cost advantages.

SN100C7A is a high melting point patent pending lead-free solder alloy. An extension of Nihon Superior’s high-reliability SN100C alloy, SN100C7A provides the benefits of the nickel modified microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. It can be applied to the assembly of power modules that require a high melting point alloy.

LF-Z3 PF-14 D3 is a SnZn paste designed for reducing the Ag-erosion such as silver pad. With peak reflow temperatures of approximately 225°C, the reflow temperature is 15°C lower than SAC. Due to the high reactivity of the SnZn alloy, a flux medium with activation control is required. PF-14 flux medium is especially designed to maintain a stable viscosity during storage to preventing any degradation of the paste. Additionally, LF-Z3 PF-14 is completely halogen-free, meaning that it does not contain F, Cl, Br or I. 

For more information about Nihon Superior’s new developments and lead-free products, meet company representatives in Booth #3044 at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

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