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Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Feb 22, 2012

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications. 

The new low expansion coefficient, filled encapsulants are designed to protect wire bonds and reduce stresses associated with thermal cycling. Additionally, the materials are engineered to withstand circuit board reliability test criteria.

DE-7826 and CE-7826 have thermal expansion coefficients in the 20 ppm range when measured by Thermal Mechanical Analysis (TMA). Both products have high glass transition temperatures (Tg) and modulus to retain their low expansion properties throughout the operating temperature range of the circuit board.

The encapsulants meet circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments. DE-7826 and CE-7826 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the new DE-7826 and CE-7826 Dam and Fill Chip Encapsulants or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

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