SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Feb 22, 2012

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications. 

The new low expansion coefficient, filled encapsulants are designed to protect wire bonds and reduce stresses associated with thermal cycling. Additionally, the materials are engineered to withstand circuit board reliability test criteria.

DE-7826 and CE-7826 have thermal expansion coefficients in the 20 ppm range when measured by Thermal Mechanical Analysis (TMA). Both products have high glass transition temperatures (Tg) and modulus to retain their low expansion properties throughout the operating temperature range of the circuit board.

The encapsulants meet circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments. DE-7826 and CE-7826 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the new DE-7826 and CE-7826 Dam and Fill Chip Encapsulants or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

45 more news from Engineered Materials Systems, Inc. »

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 19, 2017 -

Logic PD Appoints Eric Wilkowske as Vice President of Products, Design & Engineering

Jul 18, 2017 -

ASSEMBLY-TECH LLC to Represent PDR Americas

See electronics manufacturing industry news »

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications news release has been viewed 694 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications
How FactoryLogix Helped Sparton Corp. Achieve Regulatory Compliance

Plasma Prior to Conformal Coating