Indium8.9 Solder Paste offers Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.
Indium8.9 Solder Paste delivers unsurpassed print transfer efficiency and response-to-pause printing, as well as low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology.
It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements.
Indium8.9 Solder Paste is extremely thermally stable and is designed to maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing.
Overall, Indium8.9 Solder Paste provides superior performance characteristics that increase customers’ cost savings and finished goods reliability.
Indium Corporation will be exhibiting at Booth # 3415.
For more information about Indium8.9 Solder Paste, visit indium.com/indium8.9series or email firstname.lastname@example.org.