Chalman Technologies hosts Hesse & Knipps West Coast Demo and Apps Lab
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.
Hesse & Knipps’ western region customers can now more conveniently test and troubleshoot applications on Hesse & Knipps’ Bondjet BJ 820 High Speed Fully Automatic Fine Wire Wedge Bonder, the fastest wedge bonder on the market, while prospective customers can validate the capabilities and qualify Hesse & Knipps wedge bonders prior to making a purchase. Hesse & Knipps applications engineers staff the Demo and Applications Lab, working directly with customers.
“We are very pleased to partner with Chalman Technologies - one of the most professional rep organizations in the industry - to bring our new applications lab to western region customers and prospects. Rather than fly across the country, western region customers can now more readily test new and existing applications using our latest wedge bonder technology,” notes Joseph Bubel, president of Hesse & Knipps, Inc. “Chalman Technologies offered an ideal location that was close to our western region customer base and the growing RF and microwave market.”
For more information on Hesse & Knipps West coast demo and applications lab or to schedule a visit, e-mail email@example.com.
Chalman Technologies is an engineering-oriented manufacturers' representative organization experienced in semiconductor, fiber optic and other microelectronics technologies, Chalman Technologies has served as Hesse & Knipps’ rep for nearly 25 years. “We are pleased to partner with Hesse & Knipps as the headquarters for the company’s West Coast Demo and Applications Lab, which is now open and ready to service customers throughout the region,” notes Keith Chalman, VP, Chalman Technologies. “We also are proud to represent the best wedge bonder on the market.”
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.