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ACD to Offer Test Expertise for Medical Applications at MD&M Texas 2012

Feb 15, 2012

ACD, a leading supplier to the electronics industry, will highlight its test capabilities in Booth #200 at the Medical Design & Manufacturing Texas Exposition, scheduled to take place March 14-15, 2012 at the Fort Worth Convention Center in Texas. As part of the company’s comprehensive service offering, ACD provides flying probe, boundary scan and functional test capabilities.

With single- and double-sided flying probe testers, ACD offers its customers confidence in receiving quality, defect free assemblies. The company uses Acculogic ScanNavigator™ software, a powerful suite of both hardware and software tools specially designed for testing of electronic devices, boards and systems using the IEEE 1149.1 and IEEE 1149.4 standards. Also, ACD’s test department offers JTAG consultation and test coverage for designs that employ boundary scan components as well as in-system programming of programmable logic devices such as FPGAs and flash memories.

ACD’s functional testing verifies that each of the various product capabilities defined in the design specification or test specification meet their requirements. In addition to Flying Probe Test, Functional Test is instrumental in providing ACD’s customers with quality, defect free assemblies. ACD works closely with its customers and the Functional Test Department to develop an accurate test for each assembly.

With its new medium to high-volume Juki lines, ACD averages 1.5 turns per day. On the MYDATA lines, the company usually completes up to four turns per day because these lines perform prototypes or small batch runs. The Juki lines also have this capability, and this flexibility allows ACD to process complex builds back-to-back with very little down time.

For more information about ACD’s design and contract assembly services, stop by Booth #200 at MD&M Texas or visit www.ACDUSA.com.


Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and thru-hole mixed technology assembly, box build, rework, X-Ray, flying probe and functional test, and development.

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