Feb 15, 2012 
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT.
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms, POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding.
The following topics will be covered:
- What is Package on Package (PoP)?
- Component standards
- PCB design rules
- Application of tack flux or dip paste
- Optical and X-ray inspection
- Rework and repair
- Question and answer session
The Webinar is presented by Bob Willis and members of the POP Centre Team, and is sponsored by Global SMT & Packaging magazine. Space is limited to 100 attendees. Reserve your Webinar seat now.
After registering, you will receive a confirmation email containing your unique logon ID and information about joining the Webinar. We recommend you test the “Click to Join” link before the event to ensure that you are able to successfully launch the webinar software. If you encounter connectivity issues, this may be due to your company’s Internet security policies, which will need to be addressed by your IT department. Please also read the audio checklist on the email prior to the date of the Webinar to maximize the performance of the equipment for you and your team. You also may find our own guide to setting up a Webinar useful.
System requirements for PC-based attendees: Windows® 7, Vista, XP or 2003 Server, system requirements for Macintosh®-based attendees: Mac OS® X 10.5 or newer
