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Multitest's Engineering Expert to Present Breaking Research at BiTS 2012

Feb 10, 2012

Ryan Satrom

Ryan Satrom

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Ryan Satrom, RF Engineer, will present a paper titled “Improving Power Delivery In The Test Interface” at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 4-7, 2012 Mesa, AZ.

Power integrity is the discipline of providing clean power to the device under test (DUT) by minimizing noise on the Power Delivery Network (PDN). It quickly is becoming one of the biggest challenges in test interface design. By maintaining a low impedance path from tester to DUT across all operating frequencies of the device, a constant voltage can be provided to the DUT in a high di/dt environment. The main strategy used to accomplish this is minimizing the loop inductance from the DUT to the nearest bypass capacitors.

After providing an overview of power integrity, this presentation will describe how power integrity relates specifically to the test interface, beginning with the load board. Additionally, the presentation will describe the impact of the contactor. The contactor can significantly impact the ability of the PDN to provide clean power to the DUT. It is important to understand the contactor’s influence on the PDN. This presentation will discuss the variables that impact how and when the contactor impacts the PDN.

For more information, visit www.multitest.com.


Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of test equipment for semiconductors. Multitest markets test handlers, contactors, and ATE printed circuit boards. Globally, more than 700 employees serve the company’s customers in offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand. www.multitest.com

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