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Finetech Shows Support for University Research

Feb 07, 2012

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

In conjunction with the company’s 20th anniversary this year, Finetech is celebrating the university R&D segment of its business. With a wide installed base of systems at some of the most prestigious institutions, FINEPLACER® die bonders provide an ideal solution with precision and repeatability in a platform that is perfect for advanced technology environments utilizing diverse applications.

The FINEPLACER® Pico MA is an “all-in-one” modular platform for advanced packaging and assembly applications - such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information or to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html.


Finetech is a leading manufacturer of equipment for manual and fully automatic component rework and high-precision bonding and die attach. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research.  Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions.  Corporate headquarters and main production are in Berlin, Germany.  Sales and Technical support centers are located in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.

In 2009, Finetech broadened their mid-range price rework product range by acquiring German rework and dispense specialist MARTIN GmbH of Wessling (near Munich).

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Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

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