SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Feb 07, 2012

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. J-STD-033C effectively provides guidance for this category of electronic components that has not been covered by any standard in the past.

IPC/JEDEC J-STD-033C provides surface mount device (SMD) manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Use of the standard helps achieve safe and damage-free reflow with the dry-packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.

In addition to its expanded scope, the C revision contains a correction made to the desiccant calculation and an allowance for less use of desiccant for MSL2 parts, if desired.

To help users understand the importance of moisture-barrier bags (MBBs) for maintaining the shelf life of packaged ICs and non-ICs, J-STD-033C includes diagrams of recommended, not recommended and acceptable MBB air evacuation.

The latest version of J-STD-033C is available through JEDEC at www.jedec.org or IPC at www.ipc.org/033.

 


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

JEDEC is the leading developer of standards for the microelectronics industry. Over 4,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

May 15, 2017 -

Taiwan Union Technology Corporation Receives the First IPC-4101 Qualified Products Listing Certification

May 15, 2017 -

IPC to Host Fourth Annual Reliability Forum in Germany

May 04, 2017 -

Electronics Industry Leaders Meet with Members of Congress and Leaders of Trump Administration Executives urge policymakers to support pro-manufacturing policies

May 04, 2017 -

IPC Welcomes New Senior Director of Learning and Professional Development

May 03, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

May 02, 2017 -

IPC Welcomes New White House Office on Trade and Manufacturing Policy

Apr 27, 2017 -

IPC’s U.S. Skills Gap Study Reveals Skills and Qualifications in Short Supply

Apr 22, 2017 -

Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

Apr 13, 2017 -

Congressman Discusses U.S. Policy Priorities with Staff at IPC Member-company, VirTex

(829) more news from Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs news release has been viewed 581 times

Selective Solder Wetted Nozzles

PCB Assembly Equipment Auctions