AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that Karl Seelig, Vice President of Technology, will discuss the reliability of lead-free alloys at the upcoming PB-Free Electronics Risk Management (PERM) Consortium Meeting, scheduled to take place January 31-February 2, 2012 in Arlington, Va.
Mr. Seelig will address lead-free risks and the requirements needed to properly implement lead-free into high-reliability electronics when required. He will discuss the requirements needed to be successful such as design, tracking, assembly equipment related to reflow, and rework both of newly built and field returns. Mr. Seelig also will discuss tin whiskers in lead-free, the categorization of lead-free alloys into different groups and how these groups can better help a designer choose an alloy.
In his more than 30 years of industry experience, Karl has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.
For more information about AIM, visit www.aimsolder.com.
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries.