SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from FCT ASSEMBLY, INC.


See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Jan 24, 2012

NL930PT - a no-clean, lead-free, halogen-free pin probable solder paste.

NL930PT - a no-clean, lead-free, halogen-free pin probable solder paste.

NC676 No-Clean Solder Paste

NC676 No-Clean Solder Paste

WS159 water-soluble solder paste offers best-in-class solder spread and wetting.

WS159 water-soluble solder paste offers best-in-class solder spread and wetting.

UltraSlic™ Stencil with Nano-Coating.

UltraSlic™ Stencil with Nano-Coating.

Root Cause Analysis

Root Cause Analysis

FCT Assembly is pleased to announce that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

NL930PT is a no-clean, lead-free, halogen-free pin probable solder paste. The paste is unique in  that it is a clear residue, pin probable paste that can print down to low surface area ratios consistently. 

NC676 features best-in-class solder spread and wetting, print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. The no-clean, halogen-free paste leaves a colorless residue that is penetrable, maximizing pin testability.

WS889 is FCT’s newest lead-free water soluble solder paste. The paste provides excellent wetting on all surface finishes with consistent printing down to low surface area ratios and can be run in R/H of 30-65 percent without slump.

WS159 water-soluble solder paste offers best-in-class solder spread and wetting. It also features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS159 is fully cleanable, with the widest cleaning process window in its class.

SN100C Bar Solder is used in thousands of wave soldering machines around the world and has proven its reliability in products exposed to the most severe service environments. Features to be highlighted at the show include:

  • Low drossing
  • Low copper erosion
  • Shiny finish
  • Easiest maintenance of all lead-free alloys
  • Joint reliability at least equal to that of Sn63/Pb37
  • More than 1.5 billion products assembled using SN100C with no known defects

Fine Line Stencil will showcase its new UltraSlic™ Stencil with Nano-Coating. UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the  UltraSlic™ stencil foil minimizes solder paste’s ability to stick to the stencil apertures and the bottom side of the foil.  Up to a 10X increase in the number of prints before cleaning the stencil is possible as well as successful printing at surface area ratios below 0.45. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.

Representatives from FCT Assembly and Fine Line Stencil will be on hand at the show to discuss the company’s innovative Root Cause Analysis Service.  Most OEMs and CMs are periodically confronted with challenging assemblies that have low yields and have to be fixed at rework. Unfortunately, rework costs time and money, and decreases the reliability of the product. These assembly challenges will only increase as component sizes continue to decrease. OEMs and CMs can surely determine the root cause(s) of the low yields, but most don’t have the capacity, nor the time, to take on this difficult task. 

FCT Assembly developed its Root Cause Analysis Service to specifically address the need to quickly determine the root cause(s) of low yields anywhere in the assembly process and then provide a sound solution to its customers for yield improvement. This proven process can dramatically improve process yields with any assembly, regardless of complexity.

For more information about FCT Assembly’s new paste or stencil technologies, stop by Booth #612 at the IPC APEX Expo or visit www.fctassembly.com.


FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts. The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.

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