SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nihon Superior Co., Ltd.


Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Jan 21, 2012

SN100C (551CT) fluxed-cored solder wire combines the benefits of a eutectic lead-free alloy with a robust, high-temperature capable cored flux for high-speed sequential soldering.

SN100C (551CT) fluxed-cored solder wire combines the benefits of a eutectic lead-free alloy with a robust, high-temperature capable cored flux for high-speed sequential soldering.

SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver  good reflow with chip components down to 01005 (0402 metric).

SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver good reflow with chip components down to 01005 (0402 metric).

Completely Halogen-Free  SN100C P602 D4 Solder Paste

Completely Halogen-Free SN100C P602 D4 Solder Paste

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

SN100C (551CT), the newest addition to the SN100C lead-free solder series, combines the benefits of the SN100C high reliability alloy with a sustained activity cored flux. The 551CT core flux is formulated for use with soldering tip temperatures up to 380°C while still retaining sufficient activity to ensure good tip separation.  Compared with previous formulations icicling is reduced by 90 percent and spattering by 95 percent. The silver-free SN100C alloy has a stable microstructure that can accommodate both the long-term cyclic strain and the impact loading to which solder joints can be subjected in service.

SN100C (551CT) is ideal for sequential soldering and rework.   Now in the 13th year since its introduction, the SN100C lead-free alloy continues to displace SAC305 in many applications due to its high reliability, low copper erosion, and cost effectiveness.
 
SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver good reflow with chip components down to 01005 (0402 metric). SN100C P520 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine-pitch mounting in which a reduction in joint strength is a concern due to the very small joint size. Additional benefits include low residue, excellent reflow characteristics on small pads, good hot slump performance, stable printability on small pads, excelling wetting behavior (even on brass and nickel). As an additional benefit to users, SN100C P520 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with 240° peak. The paste is a compliant alloy that provides impact strength and substantial cost advantages.

Nihon Superior also will display several next-generation products that are completely halogen-free, which means there are no intentional additions of the halogens F, Cl, Br or even I hidden in the chemistry.

SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.  The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints.
 
SN100C P603 D4 and SN100C P605 D5/D6 dispensing grade lead-free solder pastes offer superior dispensing stability, ensuring no skipped pads. SN100C P605 D5/D6 is optimized for high precision dispensing for chip components down to 01005(0402 metric).  Being completely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction.
 
SN100C (044) completely halogen-free high performance  flux-cored solder wire makes it possible to achieve  a high first-pass yield due to  its excellent wetting and spread, while providing approximately 30 percent faster soldering speeds in manual soldering when compared to the company’s previous halogen-free flux-cored solder wire.

NS-F900 is a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, allowing high topside board temperatures (up to 125°C)  and long dwell times that may be required for thick boards and dense, complex assemblies, while being environmentally friendly. NS-F900 is specifically designed for use with SN100C lead-free solder but is applicable to all lead-free alloys as well as Sn/Pb in wave soldering.

NS-F900 is designed to provide good hole-fill and easy solder joint inspection with little residue, while meeting JIS and J-STD-004 surface insulation resistance requirements. The flux’s excellent drainage results in reduced bridging and solder shorts.

For more information about Nihon Superior’s new SN100C (551CT) fluxed-cored solder wire or any of its completely halogen-free products, meet company representatives in Booth #3044 at the show or visit the company on the Web at  www.nihonsuperior.co.jp/english.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

You must be a registered user to talk back to us.

More News from Nihon Superior Co., Ltd.

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Aug 26, 2015 -

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Jun 21, 2015 -

Nihon Superior Acknowledged for 2015 SMTAI Sponsorship

Jan 27, 2015 -

Nihon Superior Announces Successful Product Launches at NEPCON Japan

Jan 19, 2015 -

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

(121) more news from Nihon Superior Co., Ltd.

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo news release has been viewed 707 times

Flying Probe Tester

Plasma Prior to Conformal Coating