SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Viscom AG


Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

Jan 19, 2012

Viscom’s S3088 SPI uses available highly accurate measurement data of the paste print to optimize post-reflow automatic optical inspection (AOI) at the end of the production line.

Viscom’s S3088 SPI uses available highly accurate measurement data of the paste print to optimize post-reflow automatic optical inspection (AOI) at the end of the production line.

IPC/APEX EXPO, booth #3629

Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

Viscom’s S3088 SPI 3-D solder paste inspection system is based on the field proven S3088 platform, combining efficiency and user-friendliness.

Viscom’s S3088 SPI uses available highly accurate measurement data of the paste print to optimize post-reflow automatic optical inspection (AOI) at the end of the production line. SPI measurement data is typically only used to classify paste print, allowing high tolerances of up to +/-50 percent volume. Viscom’s new SPI-AOI Uplink feature enables the use of information later in the process to assure post reflow defect detection while allowing high variability of the paste print process.

The evaluation of process errors, such as marginal print results that are just below the defect threshold, provides valuable information about the expected solder joint quality. For every solder joint that is subject to post-reflow inspection, the volume, shape and position data of the corresponding solder paste deposit is made known to the AOI via the Uplink interface. This allows users to automatically adapt the post-reflow AOI inspection parameters according to the expected defect type. Too little paste volume often leads to open solder joints while solder bridges could be the product of excessive paste deposits. The consequently tighter classification of the AOI results in better defect detection while reducing false alarms.

Additionally, the depiction of paste images and additional data, together with AOI solder joint images at the post-reflow verification station, enhances the manual classification process.

Viscom’s AOI and SPI systems, as well as the results of a recent field study to verify the improvement through the SPI-AOI Uplink feature, will be presented at the show.

You must be a registered user to talk back to us.

More News from Viscom AG

Oct 16, 2016 -

Cirtronics Installs Powerful 3D AOI Solution for Accurate Inspection Results

Oct 04, 2016 -

Extraordinarily Realistic 3D AOI from All Perspectives with the Viscom 360View

Sep 29, 2016 -

Viscom Enables Greater CCI Inspection Range with HighDensity Module

Aug 30, 2016 -

The Best Inspection from all Perspectives with Viscom’s New 360View Feature

Aug 24, 2016 -

Viscom Remains a Strategic Supplier to Continental in the Automatic Optical Inspection Area

Jul 26, 2016 -

New Viscom 3D AOI line-up and 360View feature for improved 3D inspection

Apr 20, 2016 -

Viscom to Exhibit Powerful X-ray Inspection Lineup at NEPCON China 2016

Apr 07, 2016 -

Bosch Decides for AXI from Viscom

Mar 23, 2016 -

Horizon Sales Named Viscom Representative of the Year

Mar 18, 2016 -

The New X8011-II PCB—Offline X-ray with Unbeatable Brilliance, Complete 3D and Intelligent Linking

(71) more news from Viscom AG

Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo news release has been viewed 1090 times

Solder Paste Inspection