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LPKF to Exhibit the Latest in Laser Technology at MD&M West Conference and Expo 2012

Jan 17, 2012

MicroLine 1120 S, Low Cost Option for Depaneling

MicroLine 1120 S, Low Cost Option for Depaneling

LPKF, a leading manufacturer of laser and electronics systems, announces that it will be exhibiting in booth #570 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.

LPKF will be highlighting its UV laser systems at the upcoming show. This includes the MicroLine 1120 S and 6120 S, which are designed for depaneling populated PCBs and are ideal for cutting break-out tabs and complex contours with the highest accuracy. The UV laser demonstrates its superiority over conventional cutting systems when handling rigid and flexible substrates in particular. The laser is capable of cutting board outlines, adjacent to delicate components and tracks, without causing any of the mechanical stress associated with routers or dicing saws. This allows for small subassemblies with much higher densities to be realized, with components right up to the edge of the printed circuit board.

Also being highlighted is the MicroLine 1120 P and 6120 P series which are UV laser systems designed for processing bare rigid and flexible PCB circuit boards. The UV laser cuts, drills, engraves and ablates with the tightest tolerances on a wide variety of materials making it the most versatile and inexpensive UV laser on the world-wide market today. It has the ability to cleanly cut even the most complicated patterns with minimal stress to the substrate, allowing for more circuits on a single panel and eliminating the limitations of tooling with the use of an integrated vacuum table. The MicroLine P models are especially suited for high-mix, flexible manufacturing environments.

LPKF will also be highlighting its laser plastic welding systems. Laser plastic welding has been around for decades, but with an ever increasing demand for smaller, more intricate devices, laser plastic welding is growing to become a major player in plastics joining methods. Primarily found in the automotive, medical and consumer electronics industries, LPKF laser welding systems are used for a variety of applications from small electronics housings, to highly complex and intricate microfluidic devices, and even exterior automotive lighting. The LPKF laser plastic welding system family is comprised of three main machines: the LQ Vario, LQ Power and TwinWeld3D, and with nearly unlimited customization options these machines can be fitted to suit the needs of the most demanding plastics joining projects.

For more information about these machines, please stop by booth #570 at the MD&M West Conference and Expo, or visit www.lpkfusa.com.


LPKF Laser & Electronics is the world leading manufacturer of both mechanical and laser systems for demanding tasks in printed circuit board technology and microelectronics. LPKF’s worldwide headquarters is located in Garbsen, Germany outside of Hannover and the company maintains North American headquarters in Portland, OR.

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