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Learn About ACD's Test Services for Medical Applications at MD&M West 2012

Jan 17, 2012

ACD, a leading supplier to the electronics industry, will highlight its test capabilities in Booth #777 at the Medical Design & Manufacturing West Exposition, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in California. As part of the company’s comprehensive service offering, ACD provides flying probe, boundary scan and functional test capabilities.

ACD’s Project Coordinators work closely with the company’s test department and customers to obtain the necessary information to create an accurate test for each assembly. Based on this data, the test department endeavors to create the most comprehensive test possible. This test, in addition to visual quality control, ensures a very high level of quality.

With single- and double-sided flying probe testers, ACD offers its customers confidence in receiving quality, defect free assemblies. The company uses Acculogic ScanNavigator™ software, a powerful suite of both hardware and software tools specially designed for testing of electronic devices, boards and systems using the IEEE 1149.1 and IEEE 1149.4 standards. Also, ACD’s test department offers JTAG consultation and test coverage for designs that employ boundary scan components as well as in-system programming of programmable logic devices such as FPGAs and flash memories. ACD’s functional testing verifies that each of the various product capabilities defined in the design specification or test specification meet their requirements.

All test programs are archived and available for use on subsequent builds at a later date. These programs also are available to any customers who may possess the same type of test equipment or have any other need for them.

For more information about ACD’s design and contract assembly services, stop by Booth #777 at the show or visit www.ACDUSA.com.


Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and thru-hole mixed technology assembly, box build, rework, X-Ray, flying probe and functional test, and development.

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