SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nihon Superior Co., Ltd.


Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium

Jan 13, 2012

Keith Sweatman, Nihon's Senior Technical Advisor

Keith Sweatman, Nihon's Senior Technical Advisor

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The presentation will take place during Session TA1, titled “PB-Free Advancements” on Tuesday, February 14 at 9:30 a.m.

The intermetallic compound Cu6Sn5 is a key constituent of solder joints on copper substrates and this paper, coauthored with Nihon Superior President Tetsuro Nishimura and University of Queensland’s Associate Professor Kazuhiro Nogita, will report the results of a study on the kinetics of the transformation of this compound from the hexagonal to the monoclinic form. The volume change associated with this transformation could significantly impact solder joint reliability. The work reported was undertaken as part of a research project at the University of Queensland that was funded by Nihon Superior Co. Ltd.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

You must be a registered user to talk back to us.

More News from Nihon Superior Co., Ltd.

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Aug 26, 2015 -

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Jun 21, 2015 -

Nihon Superior Acknowledged for 2015 SMTAI Sponsorship

Jan 27, 2015 -

Nihon Superior Announces Successful Product Launches at NEPCON Japan

Jan 19, 2015 -

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

(121) more news from Nihon Superior Co., Ltd.

Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium news release has been viewed 467 times

Flying Probe Tester

SMT in-printer dispensing