SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for IWLPC 2012 in San Jose, CA. John Ellis will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..."
For years there have been concerns about malicious circuits being used to disrupt our critical infrastructures. However, there was little chance that rogue chips could receive commands in the coordinated fashion required to cause serious damage. Social networks have changed all of that. Hacking a few, highly-followed, celebrity accounts would provide a perfect avenue for distributing 'self-destruct' codes to millions of Trojan chips. A widespread, cyber-physical attack, which would have been almost impossible to pull off just a few years ago, could soon become reality.
After graduating from the University of Texas with a Master's in Mechanical Engineering, John worked at Sandia National Labs, where he focused on R&D projects for the Department of Energy, Department of Defense, National Institute of Standards and Technology, and other federal agencies. His experience includes nuclear weapons testing, missile guidance (Advanced Cruise Missile), air-borne and space-borne imaging systems (Predator UAV), and semiconductor manufacturing. John’s career later took him to SEMI, a global trade association for the semiconductor industry, where as VP of Technology was responsible for global semiconductor manufacturing standards.
This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer-level packaging solutions for integration, cost, and performance requirements.
Visit http://www.iwlpc.com for more information.
Contact Patti Hvidhyld at 952-920-7682 or email@example.com with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review, now in its 15th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.