SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Dec 30, 2011

Micrographs before and after 528 hours at 150°C

Micrographs before and after 528 hours at 150°C

Total thickness of IMC after 528 hours at elevated temperature

Total thickness of IMC after 528 hours at elevated temperature

Cu and Ni are the decisive factors.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

The micrographs on the left side come from a study undertaken by the University of Queensland to compare the Intermetallic layer at the interface between various lead-free solders and a copper substrate. The fluxed copper/OSP test boards were exposed to the solders for five seconds in a mini-wave machine with a pot temperature of 255°C. It was found that after 528 hours at 150°C, the intermetallic compound on the board soldered with Sn-0.7Cu-0.05Ni was smoother with slower growth of Cu3Sn and no cracking. By contrast, the IMC layer in Sn-0.7Cu-0.3Ag and Sn-0.7Cu-0.3Ag-0.1B with additions of 0.3 Ag and 0.3 Ag+0.1Bi was uneven with growth of Cu3Sn and cracking (Figure 2).

The Sn-0.7Cu-0.05Ni is the basis for Nihon Superior’s SN100C® solder that also incorporates a Ge addition as an antioxidant and flow promoter.

Silver-free, lead-free solder, SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability. The first of the new SN100C Advantage Series®, SN99CN, builds on the strengths of the Sn-Cu-Ni formulation of SN100C with a controlled addition of silver. Both SN100C and SN99CN include Cu and Ni to form the stable IMC (Cu,Ni)6Sn5. These alloys will be exhibited under the theme “Implementing Lead-Free Soldering with Cost Reduction AND Reliability” at INTERNEPCON JAPAN 2012 to be held at the Tokyo Big Sight from January 18-20 (Booth No. East 13-30, East Hall 6).

Aug 15, 2017 -

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 10, 2017 -

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Feb 16, 2017 -

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Jan 10, 2017 -

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Feb 16, 2016 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Dec 28, 2015 -

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Oct 21, 2015 -

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 11, 2015 -

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

124 more news from Nihon Superior Co., Ltd. »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders news release has been viewed 868 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders
SMT Equipment Online Auctions

 Reflow System