SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Dec 30, 2011

Micrographs before and after 528 hours at 150°C

Micrographs before and after 528 hours at 150°C

Total thickness of IMC after 528 hours at elevated temperature

Total thickness of IMC after 528 hours at elevated temperature

Cu and Ni are the decisive factors.

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

The micrographs on the left side come from a study undertaken by the University of Queensland to compare the Intermetallic layer at the interface between various lead-free solders and a copper substrate. The fluxed copper/OSP test boards were exposed to the solders for five seconds in a mini-wave machine with a pot temperature of 255°C. It was found that after 528 hours at 150°C, the intermetallic compound on the board soldered with Sn-0.7Cu-0.05Ni was smoother with slower growth of Cu3Sn and no cracking. By contrast, the IMC layer in Sn-0.7Cu-0.3Ag and Sn-0.7Cu-0.3Ag-0.1B with additions of 0.3 Ag and 0.3 Ag+0.1Bi was uneven with growth of Cu3Sn and cracking (Figure 2).

The Sn-0.7Cu-0.05Ni is the basis for Nihon Superior’s SN100C® solder that also incorporates a Ge addition as an antioxidant and flow promoter.

Silver-free, lead-free solder, SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability. The first of the new SN100C Advantage Series®, SN99CN, builds on the strengths of the Sn-Cu-Ni formulation of SN100C with a controlled addition of silver. Both SN100C and SN99CN include Cu and Ni to form the stable IMC (Cu,Ni)6Sn5. These alloys will be exhibited under the theme “Implementing Lead-Free Soldering with Cost Reduction AND Reliability” at INTERNEPCON JAPAN 2012 to be held at the Tokyo Big Sight from January 18-20 (Booth No. East 13-30, East Hall 6).

Apr 03, 2018 -

Nihon Superior to Exhibit the New SN100CV Solder Alloy at NEPCON China

Mar 27, 2018 -

Nihon Superior Rebrands SN100C Alloy with New Logo

Mar 22, 2018 -

Tetsuro Nishimura Earns IPC Distinguished Committee Service Award

Jan 28, 2018 -

Nihon Superior to Introduce New SN100CV Solder Alloy at APEX

Aug 15, 2017 -

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 10, 2017 -

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Feb 16, 2017 -

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Jan 10, 2017 -

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Aug 30, 2016 -

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Mar 09, 2016 -

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

128 more news from Nihon Superior Co., Ltd. »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders news release has been viewed 1 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders
Flying Probe Probe Tester with AOI

used pcb assembly equipment - lel semi