ACD, a leading supplier to the electronics industry, announces the purchase of a VisionMaster 150 solder paste inspection (SPI) system. The VM150 will enable ACD to obtain 3-D color profiles for fast, accurate paste analysis.
VM150 is an exceptional value and will enable ACD to improve its production yields. “ACD’s product offering includes part-on-part and large boards with a significant number of fine-pitch SMT and BGA devices. ASC International’s VisionPro Series enables our engineering staff to monitor paste and stencil performance, which allows us to maximize our throughput and yields,” commented ACD President W. Scott Fillebrown about the purchase.
Additionally, the SPI system features sophisticated, 3-D technology coupled with an intuitive Windows® XP/7 interface and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3-D measurements of solder paste pads, BGAs and many other PCB features. The completely automatic measurement process eliminates operator errors and offers excellent measurement repeatability.
VisionPro is the latest in ASC International’s line of class-leading 3-D SPI systems. VisionPro incorporates the most advanced, rapid 3-D inspection technology into a new vibration-free platform engineered for performance. Designed with feature-rich software including one-click measurements, real-time SPC run charts, customized data reports and onboard work instructions, VisionPro is the most cost-effective, user friendly and production-oriented SPI system available in the industry today. Building on more than 20 years of business and more offline installations worldwide than all other current manufacturers combined, ASC International is a reliable, long-term SPI solutions provider.
For more information about ACD’s design and contract assembly services or to view the redesigned Web site, visit www.ACDUSA.com.
Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and thru-hole mixed technology assembly, box build, rework, X-Ray, flying probe and functional test, and development. For more information, visit www.ACDUSA.com.