SMT, PCB Electronics Industry News

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News from Universal Instruments Corporation

Universal Showcases Two SM Platforms at Productronica 2011

Nov 08, 2011

The GX-37D is the first true multi-purpose surface mount platform, placing chips at high-speed and extending through extreme odd-form component placement.

The GX-37D is the first true multi-purpose surface mount platform, placing chips at high-speed and extending through extreme odd-form component placement.

Universal Instruments extends its Genesis Platform portfolio with the introduction of the Genesis GX-37D at the Productronica 2011 tradeshow in Munich, Germany, November 15-18. The GX-37D is the first true multi-purpose surface mount platform, placing chips at high-speed and extending through extreme odd-form component placement. Visit Universal in Hall A3, Stand 440 to see a demonstration on both the GX-37D and the Advantis 3® AC-90T - the highest-performance platform for cost-sensitive production.

The Genesis GX-37D utilizes an exclusive combination of head technologies, making it the industry’s fastest and most flexible multifunction solution, but also presenting opportunities for this platform to be a very effective up-line module,” says Universal Vice President of Marketing Debbora Ahlgren. “This capability provides substantial value for our customers across a wide range of markets by giving them the performance and flexibility to reduce their total cost of ownership,” adds Ahlgren. “Additionally, the Advantis AC-90T is enjoying great market response since winning the NPI Award at APEX in April, 2011. Showing it, again, for a European audience is exciting!

The GX-37D combines the world’s fastest placement head - the Series 2 Lightning® - with Universal’s versatile InLine7 head for an unmatched component range of 01005 passives to 150mm square. Further, it handles odd-form components up to 25mm tall with 2.5kg grams of placement force and features nozzle-changer support for gripper nozzles. The GX-37D complements this versatility with the highest output per square meter of any multifunction solution. This unprecedented combination of functionality and performance enables condensed, highly efficient line solutions and automation of processes that were previously manual.

The GX-37D allows manufacturers to quote any job and achieve maximum productivity. It provides an efficient stand-alone prototyping solution, or a powerful line balancer capable of taking on component placements from up-line or down-line machines in order to alleviate bottlenecks and maximize utilization. It also saves significant floor space by replacing two or more platforms with a single machine. These advantages translate into the lowest overall cost of ownership by reducing initial capital expenditures, maintenance, air and power consumption, NPI programming, number of operators, and manual assembly costs.

Universal will also be demonstrating the Advantis 3 AC-90T - initially launched at APEX 2011- for the European market. The AC-90T is configured with three Lightning heads to improve line output and lower production costs in cost-sensitive markets. This high-speed platform is a powerful building block for Tier 2/3 OEMs and CEMs, medium/high-volume consumer production, local cell phone manufacturers, and smaller automotive sub-contractors. It delivers the throughput necessary for high-volume OEM production, with the adaptability to achieve high utilization and productivity in higher-changeover CEM environments. The AC-90T also serves as a flexible single-machine solution.

Genesis Series 2 Platform Product Information:

Genesis is the most capable platform available, delivering the ultimate in scalable performance for standard to extreme surface mount applications. Genesis enables semiconductor performance at surface mount speeds with 1μm positioning, while maintaining the flexibility to take on any odd-form challenge. The Genesis Series 2 portfolio offers several improvements to reduce the total cost of ownership and improve investment protection. Throughput has been improved by an average of 10% and vision capabilities enhanced to process multiple-field-ofview components two to three times faster. Board size capability has been increased by 40%, up to 1016mm long. Additionally, a Vertical Part Sensor (VPS) is now available on the Lightning head to verify part presence and position on the spindle prior to placement.

Advantis 3 Platform Product Information:

The Advantis 3 Platform portfolio includes both 1- and 3-beam base models driven by a patented VRM linear motor positioning system delivering high accuracy, acceleration and velocity without the downtime of lead screw-driven positioning systems. Additional classleading technologies include the Lightning head - the industry’s fastest – and a host of easily integrated performance options that provide superior investment protection for growing requirements.

Advantis 3 re-defines scalability as vision capability can be expanded or spindles added without changing heads, delivering a throughput of up to 34,200 cph on a single-beam platform. A class-leading component range of 01005 passives through 150mm connectors and expansive odd-form capabilities further differentiate Advantis 3 in its class. A comprehensive suite of NPI software tools extends beyond new product introduction, assisting throughout production to achieve 100% first-pass yields and ensure the best possible PPM.

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.

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