SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Conductive Materials, LLC


Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules

Nov 08, 2011

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.

The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. The DB-1588 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material has a 40 percent lower cost than ECM’s standard silver filled product.

The DB-1588 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications as well as conductive grid inks for photovoltaic applications.

For more information about the DB-1588 Conductive Back Contact Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future.

You must be a registered user to talk back to us.

More News from Engineered Conductive Materials, LLC

Nov 15, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding

Oct 06, 2016 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative tone Photoresists at Semicon Europa

May 09, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC

Aug 23, 2015 -

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

Feb 26, 2013 -

Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications

Jan 21, 2013 -

Engineered Material Systems Introduces New Low-Temperature Cure Die Attach

Dec 04, 2012 -

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Nov 27, 2012 -

Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai

Nov 27, 2012 -

Rocket EMS Awarded ISO 13485:2003 Certification

Nov 02, 2012 -

Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at the MWT Back Contact Workshop in Amsterdam

(9) more news from Engineered Conductive Materials, LLC

Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules news release has been viewed 704 times

Boundary Scan

Fluid Dispense Pump Integration