The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce its new halogen- and halide-free solder paste, Alpine OT2 in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
The newly designed flux medium for solder paste has unique properties that eliminate defects related to oxidation and miniaturization. Smaller pitch sizes and components require less solder paste; however, the paste has enough activation to meet modern process requirements.
Alpine OT2 is halogen- and halide-free, and is available with low-cost alloys such as SN100C or SCANGe-071. These solder pastes have no or low silver amounts and are ideal for cost-driven markets but the ALPINE OT2 also is available in SAC305. The rosin-based flux medium makes printing very easy even at high print speeds (>200 mm/sec).
Due to its outstanding activation system, the paste eliminates head-in-pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, such as 01005 or 0201s, this paste does not show graping or defects. It provides perfect wetting conditions for the most reliable solder joints.
The Balver Zinn/Cobar team has experts with decades of experience in all types of selective solder applications. Engineers are available to provide support whenever special attention is needed to optimize the process. For detailed studies on metallurgy and/or chemistry, the company uses its well-equipped laboratories in Balve (D) and Breda (NL).
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.