SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Viscom AG


Viscom's Demanded 3-D Solder Paste Inspection System to Be Displayed at Productronica 2011

Oct 05, 2011

André Dahlhoff, Deltec CEO, and Thomas Fischer, Project Manager at Deltec, with the new Viscom S3088 SPI system.

André Dahlhoff, Deltec CEO, and Thomas Fischer, Project Manager at Deltec, with the new Viscom S3088 SPI system.

Viscom AG, a leading supplier of AOI and AXI inspection systems in the electronics industry, will highlight its new S3088 3-D SPI solution in Hall A2, Stand 177 at the upcoming Productronica International Trade Fair, scheduled to take place November 15-18, 2011 at the New Munich Trade Fair Centre in Munich, Germany.

In March of this year, Viscom introduced its 3-D SPI solution that integrates the tried and tested sensor technology from CyberOptics. The new 3-D SPI system checks paste printing with the highest possible speed and precision and enjoys high demand. The batches planned for this year were already fully booked in July.

This new addition to the Viscom product line combines the advantages of its market-leading AOI system with powerful 3-D SPI sensor technology and inspects solder paste printing with the highest possible speed and precision. Even the most demanding electronic assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected. In addition to the customary 2-D inspection for misalignment, completeness and smearing, soldering paste height, surface area and volume also are reliably recorded and inspected.

The S3088 SPI 3-D technology does not require calibration. With the fringe projection method, the robust sensor head does not use movable parts. Depending on demand and the electronic assembly, two different test modes are available: the high resolution (HR) mode with an inspection speed up to 50 cm²/s and the high-speed mode with an inspection speed up to 80 cm²/s. As a result, inspection can be optimally adjusted to the electronic assembly and the respective requirement.

This concept also convinced André Dahlhoff, CEO of Deltec Automotive GmbH & Co. KG. in Furth im Wald, Germany. As supplier to the automotive industry, Deltec must meet high standards. The reliability of the manufactured electronic assemblies as well as the highest product quality and productivity must be guaranteed. Dahlhoff commented, "We are happy to now be able to work with the customary high Viscom standard for solder paste inspection. The performance of the S3088 SPI system convinced us during the evaluation. We appreciate the high quality of Viscom products. It was not only the inspection performance, but also the entire mechanics and workmanship that convinced us. With Viscom, we have a development partner that responds to the requirements and wishes of its customers, in addition to reliably supporting us with its service and support."

In addition to its reliable paste print inspection, the S3088 SPI system offers a unique Process Uplink. Where other inspection systems only distinguish between good and bad, this software add-on also enables the use of process indicators. Additionally, with the valuable image database with SPI and AOI error image pairs, electronics manufacturing companies now have a simple way to improve their processes.
The S3088 SPI is fully compatible with all Viscom inspection systems. Of course, the Viscom post-classification and the SPC statistics also are available.

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