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PCB Technology Challenges Discussed at SMTA International

Oct 03, 2011

The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas.  Gil White, DDi Global, will chair the session and Laura Turbini, Ph.D., Research in Motion, will co-chair.

The session covers the challenges with the co-planarity of both the substrate package and the PCB motherboard.  Presenters will discuss if room temperature co-planarity measurements predict co-planarity at Lead-Free assembly temperatures; challenges and solutions for filling of through holes and blind microvias with a copper electroplating process to provide a thermal path or a planar surface for assembly; and will also discuss the process, and how to quantify and benchmark PCB suppliers in terms of process capability, quality, and relative reliability for ATE PCBs. Papers will be presented by speakers from Intel Corporation, Atotech GmbH, and Texas Instruments, Inc.

"Solutions for today's and tomorrow's PCB challenges are the key to providing Next Generation products," commented session chair Gil White, DDi Global.

Details about SMTA International can be found online at or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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