Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C solder pastes.
The guide includes a detailed list of features for SN100C Solder Pastes. It includes SN100C P500 D4 for excellent reflow with minimum incidences of solder balling and mid-chip balling, SN100C P520 D5 for excellent reflow on very small pads and chip components down to 01005 (0402 metric), and SN100C P800 D2 low voiding paste for high-reliability assembly. Additionally, the completely halogen-free* SN100C P602 D4 features minimal incidences of corrosion-induced whiskers.
With a linear ramp to peak temperature of 240°C, SN100C lead-free solder pastes can be reflowed with a similar linear reflow profile to that commonly used with Sn-3.0Ag-0.5Cu even though the melting point of the SN100C alloy is approximately 8°C higher.
*Completely halogen-free means that it does not contain F, Cl, Br or I.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.