SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011

Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011

Sep 26, 2011

Dr. David Bernard, Product Manager X-ray Systems, Nordson DAGE

Dr. David Bernard, Product Manager X-ray Systems, Nordson DAGE

Defining the optimum system configurations for best X-ray inspection analysis

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. David Bernard, Product Manager - X-ray Systems, will present a paper titled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.  The presentation will be held during session PRC1, concerning Non-destructive Inspection and Analysis Methods, which will take place Wednesday, October 19, 2011 from 2-3:30 p.m. in room 104. Dr. Bernard co-authored the paper with his Nordson DAGE colleague, X-ray Systems Global Sales Director Keith Bryant.

Taking X-ray images goes back more than 100 years. Since then, there have been numerous advances in terms of X-ray tube and X-ray detector technology and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been rapidly driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components.

This presentation will review the various X-ray tube and detector types that are available and explain the implications of these choices for electronics inspection in terms of what they provide for inspection regarding image resolution, magnification, tube power, detector pixel size and the effects of detector radiation damage, amongst others. It also will suggest optimum configurations for the main electronics inspection tasks required today.

The ability to inspect and analyze components, substrates, solder pastes and solder joints is an important capability for any assembly operation. On-going process monitoring helps prevent problems and failure analysis capability helps fix problems. Real-time, non-destructive methods such as X-ray, acoustic micro-imaging and optical inspection are preferred for their ability to provide timely feedback without destroying the product. This session will cover advancements in these inspection and analysis methods from a user and supplier perspective.

This paper will be available to download from the Nordson DAGE website www.nordsondage.com after the event.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.

Nordson Corporation (Nasdaq: NDSN) is one of the world’s leading producers of precision dispensing equipment that applies adhesives, sealants, coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 12, 2017 -

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Sep 12, 2017 -

Nordson Brings its Flagship Inspection Systems to SMTAI

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 15, 2017 -

Nordson Brings Its Flagship Inspection Systems to SMTAI

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Apr 26, 2017 -

Nordson DAGE Picks Up Its Third Award for the Quadra™ 7 X-ray

Feb 15, 2017 -

Nordson DAGE Receives the 2017 NPI Award for Test & Inspection – X-ray

Nov 07, 2016 -

Nordson DAGE Announces Cabiotec as European X-ray Distributor of the Year for X-ray Systems 2016

Oct 06, 2016 -

Nordson DAGE Receives a Global Technology Award for Inspection – X-ray

107 more news from Nordson DAGE »

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 -

Keith Bryant to Present on Behalf of YXLON International at productronica

Oct 18, 2017 -

Metcal makes strategic move in industrial ingenuity – Learn more at productronica

Oct 18, 2017 -

Sono-Tek to Introduce New SelectaFlux-A System at productronica 2017

Oct 18, 2017 -

Aegis Software Brings “The Smarter Perspective” on Industry 4.0 MES Technology to Productronica

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

Oct 18, 2017 -

Data I/O to Showcase SentriX™Security Provisioning Technology and ConneXTM Smart Programming Software for Automotive Applications and Smart Factory Initiatives at productronica

Oct 18, 2017 -

Ryder Industries’ Next-Generation ERP System Goes Live

See electronics manufacturing industry news »

Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011 news release has been viewed 1266 times

  • SMTnet
  • »
  • Industry News
  • »
  • Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011
PCB machines

Plasma Prior to Conformal Coating