SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


Sep 23, 2011

IPC -  Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC Midwest Conference & Exhibition, held September 21-22, 2011, in Schaumburg, Illinois.

The awards were presented to individuals and teams who made significant contributions to IPC and the industry by lending their time and expertise through active IPC committee service.

For their leadership of the D-13 Flexible Circuits Base Materials Subcommittee that developed IPC-4204A, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry, Clark Webster, ALL Flex LLC and Michael Beauchesne, Amphenol Printed Circuits, Inc., were presented with Committee Leadership awards. Honored with Distinguished Committee Service awards for their work on IPC-4204A were: G. Sidney Cox, DuPont; Mark Finstad, Flexible Circuit Technologies, Inc.; Thomas Gardeski, Gemini Sciences, LLC; Russell Griffith, Flexible Circuits Inc.; Nick Koop, Minco Products, Inc.; Karin LaBerge, Microtek Laboratories; John Leschisin, Minco Products, Inc.; Duane Mahnke, DBMahnke Consulting; Eric Matuska, ALL Flex LLC; Steve Musante, Raytheon Missile Systems; Steven Nolan, Lockheed Martin Maritime Systems & Sensors; Rolland Savage, High Performance Copper Foil Inc.; Robert Sheldon, Pioneer Circuits Inc.; Terry Shepler, Electro-Materials, Inc.; and Brent Sweitzer, Multek Flexible Circuits, Inc.

For his leadership in developing IPC-CH-65B, Guidelines for Cleaning of Printed Boards and Assemblies, Mike Bixenman, Kyzen Corporation, received a Committee Leadership award. For their outstanding contributions to IPC-CH-65B, Douglas Pauls, Rockwell Collins and William Kenyon, Global Centre Consulting, earned Distinguished Committee Service awards. Special Recognition Awards were bestowed upon: David Adams, Rockwell Collins; Jeff Kennedy, Celestica; Michael Savidakis, Petroferm Inc.; Douglas Schueller, AbelConn, LLC; Carlyn Smith, Harris Corporation, GCSD; Steve Stach, Austin American Technology; Bill Vuono, Raytheon Company; Harald Wack, ZESTRON America; and Lee Wilmot, TTM Technologies, Inc., for their contributions to IPC-CH-65B.

For their leadership of the 2-30 Terms and Definitions Committee that developed IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, Michael Green, Lockheed Martin Space Systems Company and Vicka White, Honeywell Inc. Air Transport Systems, earned Committee Leadership awards. For their contributions to IPC-T-50J, Alan Exley, Raytheon Company; Mahendra Gandhi, Northrup Grumman Aerospace Systems; Alisha Groop, Lockheed Martin Space Systems Company; Thomas Kemp, Rockwell Collins; J. Lee Parker, JLP; Paul Reid, PWB Interconnect Solutions Inc.; and Gordon Sullivan, Royal Adhesives & Sealants, were honored with Distinguished Committee Service Awards.

For their leadership of the 7-11 Test Methods Subcommittee that updated and reorganized IPC-TM-650, Test Methods Manual, Graham Naisbitt, Gen3 Systems Limited and Joseph Russeau, Precision Analytical Laboratory, Inc., received Committee Leadership awards.

For contributions to IPC-TM-650, Distinguished Committee Service awards were given to: David Corbett, Defense Supply Center Columbus; Brian Madsen, Continental Automotive Systems; Chris Mahanna, Robisan Laboratory Inc.; Renee Michalkiewicz, Trace Laboratories – Baltimore; Lynn Norman, U.S. Army Aviation & Missile Command; Debora Obitz, Trace Laboratories – Baltimore; John Radman, Trace Laboratories – Denver; Russell Shepherd, Microtek Laboratories; and Greg Vorhis, Coastal Technical Services.

For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or

IPC ( is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

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