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Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Sep 23, 2011

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during session AAT8, concerning Voids in Ball Grid Array Solder Joints: Aggravation and Policing, which will take place on Wednesday, October 19, 2011 from 4-5:30 p.m. in room 202B. 

Dr. David Bernard, Dr. Evstatin Krastev, John Travis and Vineeth Bastin of Nordson DAGE are co-authors with Dave Hillman and his colleagues at Rockwell Collins on a paper entitled ‘The Last Will and Testament of the BGA Void’. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. A proposed BGA void requirement revision for the IPC-JSTD-001 specification has been extracted from the results analysis.’


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.

Nordson Corporation (Nasdaq: NDSN) is one of the world’s leading producers of precision dispensing equipment that applies adhesives, sealants, coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.

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