SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ZESTRON Corporation


ZESTRON, Kester, DfR Solutions and Other Industry Partners to Host SMT Troubleshooting Workshop on September 27th and 28th

Sep 12, 2011

Together with Kester and DfR Solutions as well as four other well-known EMS suppliers, ZESTRON, the worldwide leading provider of cleaning process solutions, services and training for the electronics manufacturing industry, will host an extensive, free-of-charge, one day workshop at ZESTRON’s US headquarters on September 27 and 28, 2011,  from 8:15 am to 5:00 pm.

With seven presentations and hands-on training provided by each of the participating companies, this comprehensive one-day workshop will provide in-depth information on the key elements for a successful SMT process.

In particular, Kester will address potential reliability challenges caused by solder paste and flux residues as well as decreasing pitch. DfR Solutions will provide detailed information on contamination and cleanliness and a practical approach to today’s challenging industry requirements.

Additionally, this theoretical as well as practical workshop will feature presenters from Speedline, MPM, SMT North America, Sawa and ZESTRON to thoroughly cover topics, such as stencil cleaning, reflow oven as well as inline cleaning process optimization and troubleshooting techniques, cleaning process control methodologies and detailed information on how to optimize your printer’s underside wipe process.

For more information or to participate in this free-of-charge event, please contact Sal Sparacino at s.sparacino@zestronusa.com or visit http://www.zestron.com/us/electronics/upcoming-events.html.


Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. With the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements.

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