SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit at the 2011 Assembly & Automation Technology Expo

Engineered Materials Systems to Exhibit at the 2011 Assembly & Automation Technology Expo

Sep 07, 2011

Engineered Materials Systems (EMS) will exhibit in Booth #853 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.

EMS is an ISO 9001/TS 16949 registered manufacturer of adhesives, conductive adhesives, potting compounds and encapsulants, serving the appliance, automotive, filter, lighting, medical, microelectronics and solar industries.

Company representatives will be available throughout the exhibition to discuss EMS’s full line of adhesives and conductive adhesives for all your industrial needs. 

Visit Booth #853 at the Assembly & Automation Technology to learn how the company can define, develop and create an engineered material solution that is right for your company.

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

45 more news from Engineered Materials Systems, Inc. »

Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

See electronics manufacturing industry news »

Engineered Materials Systems to Exhibit at the 2011 Assembly & Automation Technology Expo news release has been viewed 560 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems to Exhibit at the 2011 Assembly & Automation Technology Expo
SMT Custom Nozzles

Software for SMT