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SMT, PCB Electronics Industry News

News from Surface Mount Technology Association (SMTA)


SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Sep 06, 2011

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Flextronics Industrial (Zhuhai) Ltd’s Henley Zhou was awarded the Best Paper of Technology Conference One (CS11) for “Tolerance Stack-up Analysis Case Study for SMT End to End Yield Improvement”.

Hong Kong University of Science and Technology’s Dr. Fubin Song received the award for the Best Paper of Technology Conference Two (CS11) for “Effect of Pad Design and PCB Material on the Pad Cratering Failure”.

IBM CPC’s Wayne Zhang was awarded the Outstanding Paper of Technology Conference One (CS11) for the presentation titled “Fine Pitch Compliant Pin Connector Attachment and Rework Challenges and Solutions”.

Atotech Asia Pacific Ltd’s Dr. Kenneth Lee received the award for the Outstanding Paper of Technology Conference Two (CS11) for the presentation titled” Corrosion Resistance of different PCB Surface Finishes in Harsh Environments”.

Huawei Technology’s Roger He was awarded the Best Presentation of Technology Conference One (CS11) for the presentation titled “PCB Creep Corrosion and Board Design Considerations”.

Atotech Asia Pacific Ltd’s Dr. Kenneth Lee received the award for the Best Presentation of Technology Conference Two (CS11) for the presentation titled “Corrosion Resistance of different PCB Surface Finishes in Harsh Environments”.

Nordson MARCH’s Dr. Jack Zhao received the award for the Outstanding Presentation of Technology Conference one (CS11) for the presentation titled “High Reliability and Yield Wire Bonding Processing with Plasma”.

Zymet Incorporated’s Dr. Simon Zhang received the award for the Outstanding Presentation of Technology Conference Two (CS11) for the presentation titled “Reliability Impact of Underfills on Area Array SMD Assembly with Mathematic Approach”.

Kyzen Corporation’s Phil Zhang was awarded the Best Presentation of Vendor Conference One (CS11) for the presentation titled “Cleaning Flux Residue from under Bottom Termination Components”.

PVA’s Lim Seng Chong was awarded the Best Presentation of Vendor Conference Two (CS11) for the presentation titled “Electronic Potting –Design for Success”.

Dongguan Anda Automation Equipment Co., Ltd’s Jieyuan Liu was awarded the Best Presentation of Vendor Conference Three (CS11) for the presentation titled “The Coating Equipment Application in Production”.

The award for The Best Emerging Exhibit of the Year went to ECD Inc. for its SuperM.O.L.E. Gold 2 Temperature Profiling Kit.

The award for The Best Exhibit Technology of the Year went to BTU International Inc. for its
Pyramax 125N Nitrogen Convection Reflow System.

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