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News from Association Connecting Electronics Industries (IPC)


IPC INVITES INDUSTRY LEADERS TO SUBMIT POSTER ABSTRACTS FOR IPC APEX EXPO 2012 IN SAN DIEGO

Sep 06, 2011

IPC - Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, February 28-March 1, 2012, at the San Diego Convention Center, San Diego, Calif. Poster presentations offer exposure to key engineers, managers and executives attending the show.

Technical poster presentations are being sought on all relevant electronics topics including design, materials, assembly, processes and equipment. Submissions in the areas of printed electronics, packaging & components, surface finishes, reliability and lead-free assembly are especially encouraged.  An abstract of up to 300 words summarizing technical and previously unpublished, noncommercial work covering case histories, research and discoveries should be submitted by November 25, 2011, to www.IPCAPEXEXPO.org/CFPosters.

For more information on poster submission and other participation, visit www.IPCAPEXEXPO.org/CFPosters or contact Greg Munie, Ph.D., IPC technical conference director, at GregMunie@ipc.org, or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

 


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

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