SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nihon Superior Co., Ltd.


Nihon Superior to Exhibit at Productronica India 2011

Sep 01, 2011

SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire.

SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire.

SN100C P500 is a general purpose, high-reliability no-clean lead-free solder paste.

SN100C P500 is a general purpose, high-reliability no-clean lead-free solder paste.

SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver  good reflow with chip components down to 01005 (0402 metric).

SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver good reflow with chip components down to 01005 (0402 metric).

SN100C (044) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that does not contain F, Cl, Br and I.

SN100C (044) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that does not contain F, Cl, Br and I.

SN100C P602 is a halogen-free, high-reliability, no-clean lead-free solder paste that does not contain F, Cl, Br and I.

SN100C P602 is a halogen-free, high-reliability, no-clean lead-free solder paste that does not contain F, Cl, Br and I.

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition, scheduled to take place September 13-16, 2011, in Hall 11 at the Pragati Maidan, New Delhi, India.

The SN100C alloy has more than 10 years of success and innovation. During the decade of SN100C’s service in the industry, SN100C has been finding popularity and providing superior solutions in numerous markets.

SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire. The wire provides good separation of the solder from the tip with reduced incidence of icicles. It also provides numerous benefits including less tip and pad carbonizing, less flux splatter, less flux residue cracking, fast soldering and melting, good spread, and substantial cost advantages. Additionally, the wire provides fewer shrinkage defects, reduced copper erosion and a stable intermetalic layer.

SN100C P500 is a general purpose, high-reliability no-clean lead-free solder paste.  Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 240°C. However, it brings to reflow soldering the advantages that have made SN100C such a popular choice in wave soldering, i.e. smooth shiny fillets with no shrinkage defects, high ductility and stable intermetallic with consequent superior performance under vibration, and impact loading. The SN100C P500 no-clean halide-free medium delivers excellent
printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no
solder balls and minimal clear residue.

SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver  good reflow with chip components down to 01005 (0402 metric). SN100C P520 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine-pitch mounting in which a reduction in joint strength is a concern due to the very small joint size. Additional benefits include low residue, excellent reflow characteristics on small pads, good hot slump performance, stable printability on small pads, excelling wetting behavior (even on brass and nickel). As an additional benefit to users, SN100C P520 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with 240℃ peak. The paste is a compliant alloy that provides impact strength and substantial cost advantages.

SN100C (044) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that does not contain F, Cl, Br and I. This wire provides good separation of the solder from the tip with reduced incidence of icicles. Additionally, it results in reduced cracking of flux residue, fewer shrinkage defects, reduced copper erosion, cost advantages and a stable intermetallic layer.

SN100C P602 is a halogen-free, high-reliability, no-clean lead-free solder paste that does not contain F, Cl, Br and I. Designed as a high-reliability solder paste for high-density assembly with stable printability, the paste provides excellent reflow with good wetting and minimum incidence of mid-chip balling, low residue and significant cost advantages. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240°C peak.

As an additional service, Nihon Superior now has a preform capability. It can provide very fine wire/cored wire down to 0.1 mm. Also, the company can provide SN100C as a foil and spheres for BGA.

For more information about any of the above SN100C products, please visit Nihon Superior in booth 1060 at Productronica India 2011.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

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