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FINEPLACER® Micro Assembly Highlights at Productronica 2011

Aug 30, 2011

Fully-automated Sub-micron Bonder FINEPLACER® femto

Fully-automated Sub-micron Bonder FINEPLACER® femto

Semi-automated bonding system FINEPLACER® matrix ma

Semi-automated bonding system FINEPLACER® matrix ma

Multi-purpose bonding system FINEPLACER® pico ma

Multi-purpose bonding system FINEPLACER® pico ma

At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.

Fully-automated Sub-micron Bonder FINEPLACER® femto

The FINEPLACER® femto is a fully-automated bonder with sub-micron placement accuracy. With unrivaled versatility and excellent cost-performance ratio, the system is setting standards in its class. Globally, the FINEPLACER® femto is the key for successful process development or production environment projects.

The FINEPLACER® femto is designed for application flexibility. The modular system architecture allows easy integration of today’s and tomorrow’s bonding technologies and applications.
A typical application showcase for the FINEPLACER® femto is sensor assembly with chip arrays or matrices bonded to large substrates with defined distances. The intelligent bonding software offers a quick selection of the particular panel. It automatically generates thousands of sub-systems and parametrically calculates the correct bonding positions

Another popular field of application can be found in the mounting of optical sub-assemblies like TOSA/ROSA or transceivers. Active optical components, such as lasers or photo diodes, are being passively aligned with highest precision to optical substrates (carriers, small circuits, etc.) and soldered with Indium or AuSn. Alternatively, various adhesive technologies can be deployed. The approach of passive alignment is saving time and money and guarantees perfect and reproducible results.

Semi-automated bonding system FINEPLACER® matrix ma

The FINEPLACER® matrix ma offers 3 µm placement accuracy across large substrates such as 12 inch wafers, which opens an extra wide spectrum of possible applications.

High accuracy, a generous working distance, innovative detail solutions such as tool shifting, the HD process video module, the process integrated CleverDispense system, automated processes as well as a multitude of available technologies gives the FINEPLACER® matrix ma perfect preconditions for three-dimensional stacking of hybrid sub-assemblies like MEMS/MOEMS and various C2W applications.

The innovative Plug & Work concept allows quick exchange and integration of process modules and easy servicing access.

At Productronica, the focus will be on demanding chip-on-tape applications.

Multi-purpose bonding system FINEPLACER® pico ma

FINEPLACER® pico is available in manual and motorized configurations for a wide spectrum of micro assembly applications, especially prototyping, R&D and in universities.

Fast retrofitting capabilities and straightforward integration of additional equipment are strong arguments. More and more customers are discovering the enhanced possibilities of a FINEPLACER® pico – i.e. using it as a tailor-made measuring system for characterization of optical components.

The visual alignment system is used for passive alignment of active optical components before they are placed onto a heatsink, preforms or a sub-mount with 5 µm accuracy. The component then is fed with current and several characterization tests can be conducted. Any testing equipment such as laser diode driver or integrating sphere can be seamlessly integrated into the system. In close cooperation with customers, Finetech develops custom-made positioning table superstructures and mechanical solutions.

Experience Finetech live at the Productronica 201 in Munich from November 15-18, in booth # A4-281.

Finetech is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.

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