The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
The Alternate Lead-Free Alloys sessions will analyze materials and processes as well as low cost solutions. Papers from Henkel, Nihon Superior Co., Indium Corporation, Senju Comtek Corporation, and Christopher Associates/Koki Solder will be presented.
Ron Lasky, Ph.D., P.E., Indium Corporation, who will chair one session, commented that, "Alternate lead-free alloys may become the mainstays for electronics assembly. Having less silver than the SAC305 default, these alloys have improved drop shock and acceptable thermal cycle performance for many applications. The low silver work has encouraged investigation into other lead-free systems. This leading edge work will be discussed at the Alternate Alloys Session."
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.