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Engineered Conductive Materials Introduces Fast Cure Conductive Adhesive for Back Contact Solar Modules

Aug 29, 2011

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.

The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. These adhesives are stress absorbing to withstand the rigors of thermal cycling, and have excellent conductive stability to back contact metallizations during damp heat exposure. The conductive adhesives are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.

The DB-1580 Series Conductive Adhesives are the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future.

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