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ECT’s CPG TO SHOWCASE THE ZIP® FAMILY AT THE INTERNATIONAL TEST CONFERENCE

Aug 24, 2011

Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of “flat” technology Pogo® pins in booth 114 at the upcoming International Test Conference (ITC), scheduled to take place September 18-23, 2011 at the Disneyland Hotel in Anaheim, CA.

ECT’s Contact Products Group will highlight its expanded line of available pitches from 0.8 mm down to 0.2 mm center spacing. ECT also will feature the high-performance Bantam®, the pin of choice for the most demanding test applications; the Mini-Mite™, for higher current and consistent C-res requirements; and the CSP series, for a wide variety of double-ended Pogo technology applications with drop-in compatibility for many competitor test probes. ECT CPG personnel will be on hand to demonstrate the company’s latest technologies and answer customer inquiries related to its new range of products, which includes:

ZIP®  SCRUB™ -  The ZIP®  SCRUB™ pin features a positive “scrub-action” pad and ball contact on lead-free plated array and peripheral devices where solder transfer causes frequent cleaning and maintenance cycles.

ZIP® KELVIN - ECT’s ZIP® KELVIN is ideal for voltage sensitive device tests on array or peripheral devices requiring sub-1 ohm resistance measurements typical in RDSON and high-power applications.

ZIP® SUPER SHORT - The SUPER SHORT is designed for 0.5 nH low impedance, high-frequency testing up to 40 Ghz.

ZIP® LongTravel - The ZIP® LongTravel Z3 Series was developed for contacting large devices and strip tests where planarity and compliance are an issue. With minimal time and cost, the Z3 series can be supplied in different overall lengths: from 3.47 to 6.8 3mm for 0.40 mm pitch; from 4.23 to 6.70 mm for 0.50 mm pitch, and; from 4.48 to 7.07 mm for 0.80 mm pitch.

Z8 Burn-In -The Z8 is suited for burn-in applications, and combines the performance features of the standard ZIP® in a “burn-in-price-point” replaceable compliant pin.

The ZIP® patented 2-D design features planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. The ZIP® Series is designed to meet today’s demanding test requirements and economics.


Everett Charles Technologies is a subsidiary of Dover Corporation (NYSE: DOV) a leading manufacturer of electrical test products and services, including Pogo test contacts, semiconductor test products, bare-board automatic test systems, and bare and loaded PCB test fixtures.  ECT manufacturing, service, and support facilities are ISO registered with locations throughout the United States, Europe, and Asia.  The company has been awarded numerous patents and participates actively in developing industry standards.  Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California, USA, 91767.

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