The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire in Booth #407 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.
Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.
SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.