SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at IPC Midwest 2011

Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at IPC Midwest 2011

Aug 22, 2011

SN100C-XF3+ solder paste and wire

SN100C-XF3+ solder paste and wire

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire in Booth #407 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.

Cobar Solder Products’ XF3+ lead-free solder paste accommodates extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.

SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.

Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.

Oct 12, 2014 -

Richard Lim Appointed to Operations Manager for Balver Zinn Singapore

Oct 07, 2014 -

Cobar Solder Products Inc. Appoints LLE Soluciones Quimicas in Mexico

Aug 25, 2014 -

Balver Zinn Group’s Area Sales Manager to Present at IPC Standard Workshop in Russia

Aug 25, 2014 -

The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

Jun 16, 2014 -

The Balver Zinn Group Introduces Mobile Web Site

Jun 02, 2014 -

Bill Yager Joins Cobar Solder Products as Director of Business Development

Feb 27, 2014 -

The Balver Zinn Group to Showcase OT2 and WW50 at APEX

Feb 25, 2014 -

Cobar Solder Products Goes to Texas for the SMTA Dallas and Houston Expos

Feb 25, 2014 -

Count On Tools Inc. Announces APEX Special

Oct 08, 2013 -

The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica

28 more news from Cobar Solder Products Inc. »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

See electronics manufacturing industry news »

Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at IPC Midwest 2011 news release has been viewed 1506 times

  • SMTnet
  • »
  • Industry News
  • »
  • Cobar Solder Products to Exhibit SN100C-XF3+ Solder Paste and Wire at IPC Midwest 2011
Fully automatic selective soldering stations

SMTA International 2017