SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Aug 18, 2011

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21-22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

To help engineers meet increasingly stringent performance requirements, the session, “Test and Measurement Solutions,” will spotlight research from Robisan Laboratory, Foresite, Agilent Technologies, Kyzen, IEC Electronics and Precision Analytical Laboratory that addresses issues from nanotechnology-based measurements for evaluating roughness of copper conductors on printed boards to evaluations of the combination of materials and processes for determining surface insulation resistance and electrochemical migration performance. In addition, Trace Laboratories will review a means to develop a counterfeit inspection procedure for incoming materials.

In “Minimizing Defects in Assembly Processing,” experts from DfR Solutions, Research In Motion Ltd., and IPC will guide participants through critical issues that influence defect levels in assembly processing, including the utilization of design for reliability (DFR) concepts to eliminate common mistakes at the design level. Also, the latest work from the IPC Solder Products Value Council (SPVC) and a new industry standard addressing visual examination and cross-sectioning for the evaluation of underfills will be discussed.

Improving printed board functionality and minimizing space through the use of both embedded and bottom termination components have received increased industry focus, but each comes with its own set of implementation challenges. To address these challenges, presentations from Solberg Technical Consulting, Indium and Ray Prasad Consultancy will be featured in, “Bottom Termination and Embedded Component Challenges.“ In addition, the session will cover the difficulties of achieving good yields due to package and printed board planarity issues that bottom termination components pose (with their absence of solder balls), as well as voiding, resulting from the outgassing of solder paste flux in proximity to thermal pads.

In “Lead-Free Solder Alloys and Thermal Cycling Performance,“ experts from Indium, Rockwell Collins, Christopher Associates and Cobar Europe B.V. will address the minute changes in alloy content that can improve drop shock and thermal cycle reliability of low-silver alloys. Participants will also be privy to two revealing studies: an investigation of a solder joint integrity assessment of tin/bismuth component surface finishes in both tin-lead and lead-free free soldering processes under thermal cycling conditions, and a ten-year study of the consistency of alloys in wave soldering processes, including contamination and copper leaching.

New research from Continental Automotive Systems, DfR Solutions and Christopher Associates will highlight the last session on September 22, “Assembly Materials and Component Reliability Testing.” This session will provide test data on a number of programs, including a comparison of solder spread results for multiple printed board surface finishes using various lead-free solder pastes; a methodology for predicting the reliability of complex ICs, such as FPGAS, ADCs and memory; and a report of performance results for a new plasma polymer printed board surface finish, including storage robustness, corrosion resistance and solderability.

Complete information on the technical sessions at IPC Midwest is available at www.IPCMidwestShow.org/conference. Attendees who register by August 19 can take 20 percent off their registration fees. Other special registration packages and options, including free exhibit hall registration, may be viewed at www.IPCMidwestShow.org/Register.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

Oct 17, 2017 -

PCB Prototype Sales Trends Often Diverge from PCB Market Trends According to New IPC Report

Oct 17, 2017 -

IPC APEX EXPO 2018 Educational Programs Highlight Technology’s Accelerating Speed of Change Registration Now Open, Show Floor More than 95% Sold

Oct 11, 2017 -

Nate Carson Joins IPC as New Director of Business Development

Oct 05, 2017 -

IPC Releases 2017 Quality Benchmark Study for Electronics Assembly

Sep 30, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

Sep 28, 2017 -

IPC Hand Soldering Competition to “Heat Up” productronica 2017

Sep 27, 2017 -

IPC Welcomes Trump Administration’s Framework on U.S. Tax Code

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

858 more news from Association Connecting Electronics Industries (IPC) »

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 -

Keith Bryant to Present on Behalf of YXLON International at productronica

Oct 18, 2017 -

Metcal makes strategic move in industrial ingenuity – Learn more at productronica

Oct 18, 2017 -

Sono-Tek to Introduce New SelectaFlux-A System at productronica 2017

Oct 18, 2017 -

Aegis Software Brings “The Smarter Perspective” on Industry 4.0 MES Technology to Productronica

Oct 18, 2017 -

Data I/O to Showcase SentriX™Security Provisioning Technology and ConneXTM Smart Programming Software for Automotive Applications and Smart Factory Initiatives at productronica

See electronics manufacturing industry news »

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS news release has been viewed 1034 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS
SMT Services - STI Electronics

Smart Factory Starter Kit - KIC