SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Aug 15, 2011

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011.  Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California.

IWLPC 2011 Tutorial Topics Include:

  • Achieving High Reliability of Lead-Free Soldering - Materials Consideration
  • Primer for the Design and Fabrication of Silicon Interposers
  • TSV and Key Enabling Technologies for 3D IC/Si Integration and WLP
  • MEMS Packaging and Reliability
  • Wafer Level Packaging
  • Chip Scale & Embedded Chip Packaging
  • IC Package Cost Reduction Using Supply Chain Modeling
  • Advanced Flip Chip Technology and Processing

This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer-level packaging solutions for integration, cost, and performance requirements.

Contact Patti Hvidhyld at 952-920-7682 or patti@smta.org with questions.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Chip Scale Review, now entering its 15th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.

Sep 18, 2017 -

LED A.R.T. Symposium Program Announced

Sep 06, 2017 -

Women’s Leadership Program at SMTA International

Sep 03, 2017 -

SMART Group to Become SMTA Europe

Aug 29, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Workshops

Aug 26, 2017 -

Electronics in Harsh Environments Conference Announced

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 14, 2017 -

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 08, 2017 -

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 06, 2017 -

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 -

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

565 more news from Surface Mount Technology Association (SMTA) »

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Rework and Professional Soldering from Ersa SMTA Guadalajara Expo

Sep 18, 2017 -

MIRTEC to Exhibit Its Award-Winning MV-6 OMNI 3D AOI System at SMTA Guadalajara

See electronics manufacturing industry news »

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials news release has been viewed 774 times

  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials
PCB Cleaning

Non-heated dispensing system