SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Conductive Materials, LLC


Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011

Aug 08, 2011

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.

The new line of conductive adhesives is designed to make contact from vias in the solar cells to the back contact sheet. These adhesives are stress absorbing to withstand the rigors of thermal cycling, and have excellent conductivity stability to back contact metallizations during damp heat exposure. The conductive adhesives are designed to cure through the encapsulant lamination and cure process.

Company representatives will be available at the show to discuss Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

Visit Hall A1, Stand B4 at PVSEC to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company.


Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future.

You must be a registered user to talk back to us.

More News from Engineered Conductive Materials, LLC

Nov 15, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding

Oct 06, 2016 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative tone Photoresists at Semicon Europa

May 09, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC

Aug 23, 2015 -

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

Feb 26, 2013 -

Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications

Jan 21, 2013 -

Engineered Material Systems Introduces New Low-Temperature Cure Die Attach

Dec 04, 2012 -

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Nov 27, 2012 -

Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai

Nov 27, 2012 -

Rocket EMS Awarded ISO 13485:2003 Certification

Nov 02, 2012 -

Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at the MWT Back Contact Workshop in Amsterdam

(9) more news from Engineered Conductive Materials, LLC

Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011 news release has been viewed 858 times

Boundary Scan

Heller Industries Mark 5获得了 2015年中国SMT远见奖 - 回焊炉领域